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Contents

README

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SSP6201P502PR

Shanghai Siproin Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89-3

SSP6201P502PR from Shanghai Siproin Microelectronics, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT power_out Regulated 5.0V output (SSP6201P502PR), ±2% accuracy, 250mA typical and 500mA max output current, with 1uF tantalum or 6.8uF ceramic output capacitor recommended.
2 VSS power_in Ground reference pin for the regulator.
3 VIN power_in Positive supply input, absolute maximum 15V (-0.3V min), with 1uF input capacitor recommended.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-89-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage Vin -0.3 15 V 3
Operating Temperature -40 85 ℃ 3
Storage Temperature -40 125 ℃ 3
Output Current Iout 250 500 mA Vin-Vout=1V 4
Low dropout voltage, 100 mA (4.0 < Vout ≤ 5.0 row, applies to 5.0V variant) Vdrop 0.17 0.18 V 4.0 < Vout ≤ 5.0; Iout=100 mA 4
Low dropout voltage, 200 mA (4.0 < Vout ≤ 14.0 row, applies to 5.0V variant) Vdrop 0.2 0.22 V 4.0 < Vout ≤ 14.0; Iout=200 mA 4
Low dropout voltage, 500 mA (4.0 < Vout ≤ 14.0 row, applies to 5.0V variant) Vdrop 0.72 0.76 V 4.0 < Vout ≤ 14.0; Iout=500 mA 4
Line Regulation 0.05 0.2 %/V 1.6V≤Vin≤8V; Iout=100mA 4
Load Regulation ΔVout 12 30 mV Vin=Vout+1V; 1.0mA≤Iout≤100mA 4
Output Voltage Temperature Coefficient -100 100 PPM/℃ Iout=30mA; 0℃≤Ta≤70℃ 4
Supply Current Iss1 2 uA 4
Input Voltage Vin 15 V 4

CAD (KiCad official)

  • Symbol: SSP6201P502PR
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3 (KiCad packages3D, STEP)
  • 3D model files: ssp6201p502pr-etched.step / ssp6201p502pr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ssp6201p502pr.step / ssp6201p502pr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (6 pp, sha256 97da1122b84e3b71, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF