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Contents

README

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ESD56281N05-2

WILLSEMI(Will Semicon) · Electrostatic And Surge Protection (TVS/ESD) · DFN1006-2L

ESD56281N05-2 from WILLSEMI(Will Semicon), in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin1 passive Terminal 1 of the uni-directional TVS; the datasheet measures the N05 ratings (VRWM 5.5 V, VBR 5.6 V min to 7.5 V max at 1 mA) from pin 1 to pin 2 and gives no separate per-pin limit.
2 Pin2 passive Terminal 2 of the uni-directional TVS; the datasheet measures the N05 ratings (VRWM 5.5 V, VBR 5.6 V min to 7.5 V max at 1 mA) from pin 1 to pin 2 and gives no separate per-pin limit.

Key specifications

Parameter Value
Manufacturer WILLSEMI(Will Semicon)
Package DFN1006-2L
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse stand-off voltage VRWM 5.5 V 3
Breakdown voltage VBR 5.6 6.4 7.5 V IBR = 1mA 3
Reverse leakage current IRM 1 100 nA at VRWM 3
Forward voltage VF 0.5 1.1 V IF = 20mA 3
Junction capacitance CJ 160 170 pF F=1MHz, VR=0V 3
Peak pulse power (tp=8/20μs) Ppk 350 W tp=8/20μs 2
ESD according to IEC61000-4-2 air discharge VESD -30 30 kV IEC61000-4-2 air discharge 2
ESD according to IEC61000-4-2 contact discharge VESD -30 30 kV IEC61000-4-2 contact discharge 2
Junction temperature TJ 125 oC 2
Operating temperature TOP -40 85 oC 2
Lead temperature TL 260 oC 2
Storage temperature TSTG -55 150 oC 2
Rated peak pulse current IPP 40 A IEC61000-4-5 8/20μs (Table 4 note 1) 3
Clamping voltage at IPP VCL 8.8 V 8/20μs, IEC61000-4-5 (Table 4 note 1) 3
Clamping voltage at IPP = 16A, tp = 100ns VCL 6.6 V IPP = 16A, tp = 100ns 3
Clamping voltage at VESD = 8kV VCL 8 V VESD = 8kV 3

CAD (KiCad official)

  • Symbol: ESD56281N05-2
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2L (KiCad packages3D, STEP)
  • 3D model files: esd56281n05-2-etched.step / esd56281n05-2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd56281n05-2.step / esd56281n05-2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI(Will Semicon) datasheet (6 pp, sha256 70fa8e9bfd4a4487, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF