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Contents

README

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LRBN25GFER022

NCT · Current Sense Resistors/Shunt Resistors · 2512

LRBN25GFER022 from NCT, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised resistor; either orientation.
2 2 passive Terminal 2 of an unpolarised resistor; either orientation.

Key specifications

Parameter Value
Manufacturer NCT
Package 2512
Category Resistors
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Rated power (2W&3W printed for LRBN25) P 2 3 W LRBN25 row prints 2W&3W; LRBN25(S) is 3W, a sibling not covered 5
Maximum rated current I 54.78 A LRBN25 row, 2W&3W; datasheet rated current formula I=SQRT(P/R) 5
Maximum overload current 122.48 A LRBN25 row, 2W&3W 5
Operating temperature range T -55 170 °C 使用温度范围 (operating temperature range) for LRBN25 5
Resistance range R 1 100 mΩ LRBN25 resistance range 1mΩ~100mΩ 5
Temperature coefficient of resistance TCR -50 50 ppm/°C Printed ±50 for 1mΩ<R≤100mΩ; TCR from R1 at room temp and R2 at 125°C 5
Temperature coefficient of resistance (low-value band) TCR -275 275 ppm/°C Printed ±275 for R≦1mΩ 5
Short time overload resistance change ΔR/R -0.5 0.5 % Printed ≦±0.5%; 5 s overload at 5× rated power (3W for LRBN25), 24 h rest 10
Biased humidity resistance change ΔR/R -0.5 0.5 % Printed ≦±0.5%; 85°C/85%RH, rated current, 90 min ON/30 min OFF, 1000 h 11
Temperature cycling resistance change ΔR/R -0.5 0.5 % Printed ≦±0.5%; -55°C to +125°C, 1000 cycles 11
Low temperature exposure resistance change ΔR/R -0.5 0.5 % Printed ≦±0.5%; -55°C, 1000 h 11
High temperature exposure resistance change ΔR/R -1 1 % Printed ≦±1.0%; 170°C, 1000 h 11
Load life resistance change ΔR/R -1 1 % Printed ≦±1.0%; 70°C, rated current, 90 min ON/30 min OFF, 1000 h 11
Resistance to solder heat resistance change ΔR/R -0.5 0.5 % Printed ≦±0.5%; 260±5°C solder bath, 10±1 s 11
Resistance to solvent resistance change ΔR/R -0.5 0.5 % Printed ≦±0.5%; isopropanol 20-25°C, 60±5 s 11
Joint strength of solder resistance change ΔR/R -0.5 0.5 % Printed ≦±0.5% under bend test load; no appearance damage 12
Solderability solder-coated electrode area 95 % Printed: electrode new-solder coverage area must exceed 95%; 245±5°C, 3±1 s 11
Insulation resistance 100 MΩ Printed >100MΩ; 100 VDC applied for 1 min between electrodes and protective coat/substrate 12

CAD (KiCad official)

  • Symbol: LRBN25GFER022
  • Footprint: Resistor_SMD:R_2512_6332Metric
  • 3D model: 2512 (KiCad packages3D, STEP)
  • 3D model files: lrbn25gfer022-etched.step / lrbn25gfer022-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lrbn25gfer022.step / lrbn25gfer022.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NCT datasheet (15 pp, sha256 1c7bbc6a4c0f07fe, retrieved 2026-11-06, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF