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Contents

README

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AP2401S-13

Diodes Incorporated · Power Distribution Switches · SO-8

AP2401S-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin, the reference for all voltages on the device (datasheet absolute maximum ratings are referred to GND).
2 IN power_in Voltage input pin: connect a 0.1µF or larger ceramic capacitor from IN to GND as close as possible, and all IN pins must be tied together externally; VIN operating range is 2.7V to 5.5V.
3 IN power_in Voltage input pin: connect a 0.1µF or larger ceramic capacitor from IN to GND as close as possible, and all IN pins must be tied together externally; VIN operating range is 2.7V to 5.5V.
4 EN input Enable input, active low for the AP2401; logic low maximum 0.8V and logic high minimum 2V.
5 FLG output Over-temperature and over-current fault reporting with 7ms deglitch; active-low open-drain output that is disabled for 7ms after turn-on.
6 OUT power_out Voltage output pin; all OUT pins must be tied together externally.
7 OUT power_out Voltage output pin; all OUT pins must be tied together externally.
8 NC unconnected No internal connection; the datasheet recommends tying this pin to the OUT pins.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SO-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input UVLO (VIN rising) VUVLO 1.6 2 2.4 V VIN rising 4
Over-Load Current Limit ILIMIT 2.05 2.5 2.85 A VIN= 5V, VOUT= 4.5V, -40°C ≤ TA ≤+85°C 4
Short-Circuit Current Limit ISHORT 2.1 2.75 3.3 A Enabled into short circuit 4
FLG blanking and latch off time TBLANK 4 7 15 ms Assertion or deassertion due to overcurrent and over-temperature condition 4
Input voltage VIN 2.7 5.5 V 3
Output Current IOUT 0 2 A 3
EN Input Logic Low Voltage VIL 0 0.8 V 3
EN Input Logic High Voltage VIH 2 V 3
Operating Ambient Temperature TA -40 85 °C 3
Input Voltage (absolute maximum) VIN -0.3 6.5 V 3
Output Voltage (absolute maximum) VOUT -0.3 V 3
Enable Voltage / Flag Voltage (absolute maximum) VEN, VFLG -0.3 V 3
Storage Temperature Range TST -65 150 °C 3
Maximum Junction Temperature TJ(MAX) 150 °C 3
ESD Machine Model ESD MM 300 V 3
ESD Human Body Model ESD HBM 4 kV 3
Input UVLO Hysteresis ΔVUVLO 50 mV VIN decreasing 4
Input Shutdown Current ISHDN 0.1 1 µA Disabled, OUT = open 4
Input Quiescent Current IQ 60 100 µA Enabled, OUT = open 4
Input Leakage Current ILEAK 0.1 1 µA Disabled, OUT grounded 4
Reverse Leakage Current IREV 0.01 1 µA Disabled, VIN = 0V, VOUT = 5V, IREV at VIN 4
Switch on-resistance RDS(ON) 70 84 mΩ VIN = 5V, IOUT= 2.0A, TA = +25°C 4
Switch on-resistance RDS(ON) 105 mΩ VIN = 5V, IOUT= 2.0A, -40°C ≤ TA ≤ +85°C 4
Switch on-resistance RDS(ON) 90 108 mΩ VIN = 3.3V, IOUT= 2.0A, TA = +25°C 4
Switch on-resistance RDS(ON) 135 mΩ VIN = 3.3V, IOUT= 2.0A, -40°C ≤ TA ≤ +85°C 4
Current limiting trigger threshold ITrig 2.5 A Output Current Slew rate (< 100A/s) 4
Short-circuit Response Time TSHORT 2 µs VOUT = 0V to IOUT = ILIMIT (OUT shorted to ground) 4
EN Input Logic Low Voltage VIL 0.8 V VIN = 2.7V to 5.5V 4
EN Input Logic High Voltage VIH 2 V VIN = 2.7V to 5.5V 4
EN Input leakage ILEAK-EN 0.01 1 µA VIN = 5V, VEN = 0V and 5.5V 4
Output leakage current ILEAK-O 0.5 1 µA Disabled, VOUT = 0V 4
Output turn-on delay time TD(ON) 0.1 ms CL = 1µF, RLOAD = 5Ω 4
Output turn-on rise time TR 0.6 1.5 ms CL = 1µF, RLOAD = 5Ω 4
Output turn-off delay time TD(OFF) 0.1 ms CL = 1µF, RLOAD = 5Ω 4
Output turn-off fall time TF 0.05 0.1 ms CL = 1µF, RLOAD = 5Ω 4
FLG output FET on-resistance RFLG 20 40 Ω IFLG = 10mA 4
FLG Off Current IFOH 0.01 1 µA VFLG = 5V 4
Discharge time TDIS 0.6 ms CL= 1µF, VIN = 5V, disabled to VOUT < 0.5V 4
Discharge resistance RDIS 100 Ω VIN = 5V, disabled, IOUT = 1mA 4
Thermal Shutdown Threshold TSHDN 140 °C Enabled 4
Thermal Shutdown Hysteresis THYS 20 °C 4
Thermal Resistance Junction-to-Ambient (SO-8) θJA 96 °C/W SO-8, Note 8: 2in x 2in FR-4, 2oz copper, minimum recommended pad layout 4

CAD (KiCad official)

  • Symbol: AP2401S-13
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: ap2401s-13-etched.step / ap2401s-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ap2401s-13.step / ap2401s-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (18 pp, sha256 8a66a76a7185a51e, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF