component
LM22676MRX
Public Made by Adomby adom
Tokmas DC-DC Converters, SOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM22676MRX
Tokmas · DC-DC Converters · SOP-8-EP
LM22676MRX from Tokmas, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BOOT | passive | Power supply bias for the high-side MOSFET gate driver; connect a 0.1uF capacitor from BOOT to SW. |
| 2 | NC | unconnected | No connect. |
| 3 | NC | unconnected | No connect. |
| 4 | FB | input | Inverting input of the transconductance error amplifier; a resistor divider from the output sets the output voltage, regulating FB to the 1.221V typical reference. |
| 5 | EN | input | Enable pin with internal pull-up current source; pull below 1.05V to disable, float or connect to VIN to enable, and a resistor divider from VIN sets the UVLO threshold. |
| 6 | GND | power_in | Ground. |
| 7 | VIN | power_in | Input supply voltage (5.5V to 60V); connect a local bypass capacitor from VIN to GND with the shortest possible path. |
| 8 | SW | output | Regulator switching output; connect to an external power inductor. |
| 9 | Thermal Pad | power_in | Die heat dissipation path, electrically connected to GND and must be connected to the PCB ground plane for proper operation and thermal performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Tokmas |
| Package | SOP-8-EP |
| Category | Power Management (PMIC) |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating input voltage | VIN | 5.5 | 60 | V | VIN=24V, TJ=-40°C~125°C | 4 | |
| Shutdown current from VIN pin | ISHDN | 2 | 5 | μA | EN=0, no load | 4 | |
| Reference voltage of FB | VREF | 1.196 | 1.221 | 1.246 | V | 4 | |
| High-side power MOSFET peak current limit threshold | ILIM_HS | 4.25 | 4.75 | 5.25 | A | 4 | |
| Switching frequency | FSW | 450 | 500 | 550 | kHz | 4 | |
| Input voltage range | VIN | 5.5 | 60 | V | 3 | ||
| Output voltage range | VOUT | 0.8 | 57 | V | 3 | ||
| Operating junction temperature | TJ | -40 | 150 | °C | 3 | ||
| VIN, EN voltage | VIN, EN | -0.3 | 65 | V | 2 | ||
| BOOT voltage | BOOT | -0.3 | 72 | V | 2 | ||
| SW voltage | SW | -1 | 65 | V | 2 | ||
| BOOT-SW voltage | BOOT-SW | -0.3 | 6 | V | 2 | ||
| SS, FB, RT/CLK voltage | SS, FB, RT/CLK | -0.3 | 6 | V | 2 | ||
| Operating junction temperature | TJ | -40 | 150 | °C | 2 | ||
| Storage temperature | TSTG | -65 | 150 | °C | 2 | ||
| ESD HBM | VESD | -2 | 2 | kV | HBM, all pins | 3 | |
| ESD CDM | VESD | -0.5 | 0.5 | kV | CDM, all pins | 3 | |
| Input UVLO threshold | VIN_UVLO | 4.3 | V | VIN rising | 4 | ||
| UVLO hysteresis | 400 | mV | 4 | ||||
| Quiescent current from VIN pin | IQ | 300 | μA | EN floating, no load, non-switching, BOOT-SW=5V | 4 | ||
| High-side MOSFET on-resistance | RDSON_H | 220 | mΩ | VBOOT-VSW=5V | 4 | ||
| Enable high threshold | VEN_H | 1.2 | V | 4 | |||
| Enable low threshold | VEN_L | 1 | V | 4 | |||
| Enable pin pull-up current | IEN_L | 1.6 | μA | EN=1V | 4 | ||
| Enable pin pull-up current | IEN_H | 5 | uA | EN=1.5V | 4 | ||
| Internal soft start time | Tss | 16 | ms | 4 | |||
| Minimum on-time | tON_MIN | 100 | ns | VIN=24V | 4 | ||
| Feedback overvoltage rising | VOVP | 110 | % | VFB/VREF rising | 4 | ||
| Feedback overvoltage falling | VOVP | 105 | % | VFB/VREF falling | 4 | ||
| BOOT UV reference voltage | VBOOTUV | 2.52 | V | BOOT-SW rising | 4 | ||
| Thermal shutdown threshold | TSD | 172 | °C | TJ rising | 4 | ||
| Thermal shutdown hysteresis | 12 | °C | 4 | ||||
| Junction-to-ambient thermal resistance | RθJA | 40.34 | °C/W | ESOP-8L | 3 | ||
| Junction to case (top) thermal resistance | RθJCtop | 61.49 | °C/W | ESOP-8L | 3 | ||
| Junction to case (bottom) thermal resistance | RθJCbot | 4.52 | °C/W | ESOP-8L | 3 | ||
| Junction-to-top characterization parameter | RψJT | 5.62 | °C/W | ESOP-8L | 3 |
CAD (KiCad official)
- Symbol:
LM22676MRX - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm - 3D model: SOP-8-EP (KiCad packages3D, STEP)
- 3D model files:
lm22676mrx-etched.step/lm22676mrx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm22676mrx.step/lm22676mrx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Tokmas datasheet (19 pp, sha256
24c40150d3226fc2, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).