BDR6307B from Bardeen Micro., in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VCC	power_in	Low-side main supply; recommended range is 4.8 V to 20 V, with an absolute maximum of -0.3 V to 25 V referenced to COM.
2	HIN	input	High-side logic input compatible with 3.3 V, 5 V and 15 V CMOS/TTL levels; input voltage must stay within -0.3 V to VCC+0.3 V.
3	LIN	input	Low-side logic input compatible with 3.3 V, 5 V and 15 V CMOS/TTL levels; input voltage must stay within -0.3 V to VCC+0.3 V.
4	COM	power_in	Low-side power ground; all voltage parameters in the datasheet are referenced to COM.
5	LO	output	Low-side gate drive output for the low-side N-MOS; output voltage range is -0.3 V to VCC+0.3 V.
6	VS	power_in	High-side floating ground (half-bridge midpoint); absolute range is VB-25 V to VB+0.3 V and dVS/dt is rated to 55 V/ns.
7	HO	output	High-side gate drive output referenced to VS; output voltage range is VS-0.3 V to VB+0.3 V.
8	VB	power_in	High-side floating supply for the bootstrap circuit; absolute range is -0.3 V to 600 V, and the recommended supply is VS+4.8 V to VS+20 V.

Key specifications

Parameter	Value
Manufacturer	Bardeen Micro.
Package	SOP-8
Category	Power Management
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
High-side floating supply voltage VB (absolute voltage range)	VB	-0.3		600	V		2
Low-side supply voltage	VCC	-0.3		25	V		2
Low-side output voltage (printed -0.3~Vcc+0.3)	VLO	-0.3			V		2
Logic input voltage HIN and LIN (printed -0.3~Vcc+0.3)	VIN	-0.3			V		2
Allowable VS voltage transient	dVS/dt			55	V/ns		2
Thermal resistance, junction to ambient (RthJA)	RthJA		200		℃/W		2
Ambient temperature (printed 环境温度)	TJ	-35		150	℃		2
Storage temperature	TS	-55		175	℃		2
Package power dissipation	PD			0.625	W	TA≤+25℃	2
Soldering temperature (10 s)	TL			300	℃	Soldering, 10 s	2
High-side floating supply voltage VB (recommended)	VB	-25		600	V		3
Low-side supply voltage (recommended)	VCC	4.8		20	V		3
Low-side output voltage (recommended, printed 0~VCC)	VLO	0			V		3
Input logic signal voltage HIN and LIN (recommended, printed 0~VCC)	VIN	0			V		3
TA 储存温度 (labelled storage temperature in recommended table)	TA	-40		125	℃		3
VCC undervoltage protection release voltage (rising)	Vccuv+	4	4.7	5.2	V		3
VCC undervoltage protection threshold voltage (falling)	Vccuv-	3.8	4.5	5	V		3
VBS undervoltage positive-going threshold	VBSUV+	4	4.7	5.2	V		3
VBS undervoltage negative-going threshold	VBSUV-	3.8	4.5	5	V		3

CAD (KiCad official)

Symbol: BDR6307B
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOP-8 (KiCad packages3D, STEP)
3D model files: bdr6307b-etched.step / bdr6307b-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bdr6307b.step / bdr6307b.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Bardeen Micro. datasheet (8 pp, sha256 d1e82c4f73a717fd, retrieved 2026-11-04, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

BDR6307B

Verified BDR6307B

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README