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Contents

README

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MSMD200

KUU · Resettable Fuses · 1812

MSMD200 from KUU, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised fuse; either orientation.
2 2 passive Terminal 2 of an unpolarised fuse; either orientation.

Key specifications

Parameter Value
Manufacturer KUU
Package 1812
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Minimum resistance prior to trip R min 0.02 Ω 25℃, prior to trip 1
Maximum resistance one hour post reflow R1max 0.08 Ω 25℃, measured one hours post reflow 1
Minimum tripping current IT 4 A 25℃ still air 1
Maximum holding current IH 2 A 25℃ still air 1
Maximum voltage withstand at rated current Vmax 16 V at rated current 1
Maximum fault current withstand at rated voltage I max 100 A at rated voltage 1
Maximum time to trip Ttrip 3 s at 8.0 A 1
Rated working power Pd typ 1.2 W 1
Maximum hold current at 85℃ ambient 1.25 A maximum ambient operating temperature 85℃ (thermal derating table) 1
Maximum hold current at -40℃ ambient 3.08 A ambient -40℃ (thermal derating table) 1
Minimum trip current at 85℃ ambient 2.5 A ambient 85℃ (thermal derating table) 1
Minimum trip current at -40℃ ambient 6.16 A ambient -40℃ (thermal derating table) 1
Maximum ambient operating temperature range -40 85 ℃ thermal derating table range 1
Average ramp-up rate 3 ℃/second solder reflow profile 1
Ramp-down rate 6 ℃/second solder reflow profile 1
Peak reflow temperature 260 ℃ solder reflow profile peak 1
Time above critical zone 60 150 s critical zone above 217℃ 1
Preheat time 60 180 s preheat 150℃ to 200℃ 1
Time from 25℃ to peak 8 minutes solder reflow profile 1

CAD (KiCad official)

  • Symbol: MSMD200
  • Footprint: Fuse:Fuse_1812_4532Metric
  • 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: msmd200-etched.step / msmd200-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); msmd200.step / msmd200.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: KUU datasheet (1 pp, sha256 34b590649b58d232, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF