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Contents

README

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STD105N10F7AG

STMicroelectronics · MOSFETs · DPAK

STD105N10F7AG from STMicroelectronics, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the MOSFET, with gate-source voltage VGS rated at ±20 V (Table 2).
2 D passive Drain terminal, rated for 100 V drain-source voltage and 80 A continuous drain current at TC = 25 °C; it is also connected to the metal tab (D(2, TAB) in Figure 1).
3 S passive Source terminal; the source-drain diode is rated for 80 A continuous source-drain current (ISD) with a forward voltage of 1.2 V at ISD = 80 A and VGS = 0 V (Table 8).

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package DPAK
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDS 100 V 3
Gate-source voltage VGS -20 20 V 3
Drain current (continuous) ID 80 A TC = 25 °C 3
Drain current (continuous) ID 62 A TC = 100 °C 3
Drain current (pulsed) IDM 320 A Pulse width limited by safe operating area 3
Total dissipation PTOT 120 W TC = 25 °C 3
Storage temperature range Tstg -55 175 °C 3
Drain-source breakdown voltage V(BR)DSS 100 V ID = 250 μA, VGS = 0 4
Zero gate voltage drain current IDSS 1 µA VDS = 100 V 4
Zero gate voltage drain current (TC = 125 °C) IDSS 100 µA VDS = 100 V, TC = 125 °C 4
Gate body leakage current IGSS -100 100 nA VGS = ± 20 V 4
Gate threshold voltage VGS(th) 2.5 4.5 V VDS = VGS, ID = 250 μA 4
Static drain-source on-resistance RDS(on) 6.8 8 mΩ VGS = 10 V, ID = 40 A 4
Source-drain current ISD 80 A 5
Source-drain current (pulsed) ISDM 320 A 5
Thermal resistance junction-case Rthj-case 1.25 °C/W 3
Thermal resistance junction-pcb Rthj-pcb 50 °C/W When mounted on FR-4 board of 1 inch², 2oz Cu 3
Single pulse avalanche energy EAS 400 mJ TJ = 25 °C, L = 3.5 mH, IAS = 15 A, VDD = 50 V, VGS = 10 V 3

CAD (KiCad official)

  • Symbol: STD105N10F7AG
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: DPAK (KiCad packages3D, STEP)
  • 3D model files: std105n10f7ag-etched.step / std105n10f7ag-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); std105n10f7ag.step / std105n10f7ag.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (14 pp, sha256 0c02e6d78b239f15, retrieved 2026-10-11, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF