component
tpa6130a2rtjr
Public Unreviewedby Ray
Texas Instruments Audio Power OpAmps, QFN-20-EP(4x4). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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README
markdownTPA6130A2RTJR
Texas Instruments · Audio Power OpAmps · QFN-20-EP(4x4)
TPA6130A2RTJR from Texas Instruments, in a QFN-20-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | LEFTINM | input | Left channel negative differential audio input. Impedance must be matched to LEFTINP. In single-ended mode, connect the left source to LEFTINM. |
| 2 | LEFTINP | input | Left channel positive differential audio input. Impedance must be matched to LEFTINM. In single-ended mode, AC-ground LEFTINP near the source while maintaining matched impedance. |
| 3 | GND | power_in | Analog ground. Connect to common supply GND. Used to decouple analog VDD. |
| 4 | RIGHTINP | input | Right channel positive differential audio input. Impedance must be matched to RIGHTINM. In single-ended mode, AC-ground RIGHTINP near the source while maintaining matched impedance. |
| 5 | RIGHTINM | input | Right channel negative differential audio input. Impedance must be matched to RIGHTINP. In single-ended mode, connect the right source to RIGHTINM. |
| 6 | SD | input | Shutdown input. Active-low; drive high to enable the device, low to place it in hardware shutdown (IDD ≤1 µA typ). 5 V-tolerant logic input (VIH ≥1.3 V, VIL ≤0.35 V). |
| 7 | SDA | bidirectional | I2C serial data. Open-drain, 5 V-tolerant. Requires an external pull-up (≤2 kΩ for a 5 V bus). Standard/Fast mode up to 400 kHz. |
| 8 | SCL | input | I2C serial clock. 5 V-tolerant input. Requires an external pull-up (≤2 kΩ for a 5 V bus). Supports SCL up to 400 kHz. |
| 9 | GND | power_in | Analog ground. Connect to common supply GND. |
| 10 | GND | power_in | Analog ground. Connect to common supply GND. |
| 11 | HPRIGHT | output | Headphone right channel output. Ground-referenced DirectPath output; connect directly to the right terminal of the headphone jack - no DC blocking capacitor required. Drives loads down to 12.8 Ω (min). |
| 12 | VDD | power_in | Analog VDD supply, 2.5 V to 5.5 V. Must be connected to the common VDD rail. Decouple with its own 1 µF capacitor to analog ground (use pin 13 for the return). |
| 13 | GND | power_in | Analog ground; used to decouple the analog VDD pin (pin 12). |
| 14 | HPLEFT | output | Headphone left channel output. Ground-referenced DirectPath output; connect directly to the left terminal of the headphone jack - no DC blocking capacitor required. Drives loads down to 12.8 Ω (min). |
| 15 | CPVSS | power_out | Negative supply rail generated by the internal charge pump. Decouple to GND (pin 19) or a GND plane with a 1 µF capacitor. Provides the negative rail for the ground-referenced headphone outputs. |
| 16 | CPVSS | power_out | Second CPVSS pin (tied internally with pin 15). Decouple to GND with a 1 µF capacitor. |
| 17 | CPN | passive | Charge-pump flying capacitor negative terminal. Connect one side of the flying capacitor (typically 1 µF) between CPP (pin 18) and CPN. |
| 18 | CPP | passive | Charge-pump flying capacitor positive terminal. Connect one side of the flying capacitor (typically 1 µF) between CPP and CPN (pin 17). Charge-pump switching frequency ≈300-500 kHz. |
| 19 | GND | power_in | Charge-pump ground. Connect to common supply GND. Recommended as the decoupling return for the charge-pump VDD (pin 20). |
| 20 | VDD | power_in | Charge-pump VDD supply, 2.5 V to 5.5 V. Must be tied to the common VDD rail. Decouple to GND (pin 19) with its own 1 µF capacitor. |
| PAD | PAD | power_in | Exposed thermal pad on the bottom of the WQFN package. Solder to the PCB GND plane for mechanical stability and enhanced thermal performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFN-20-EP(4x4) |
| Category | Op-amp/Cmp |
| Pins | 21 |
Ordering variants
TPA6130A2RTJRTPA6130A2RTJRRTJTTPA6130A2RTJRYZHRTPA6130A2RTJRYZHT
CAD (KiCad official)
- Symbol:
TPA6130A2RTJR - Footprint:
Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm - 3D model: QFN-20-EP(4x4) (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (None pp, sha256
d049f3e2327c033a, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).
Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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