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Contents

README

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SN74LS640DWR

Texas Instruments · Buffers, Drivers, Receivers, Transceivers · SOIC-20-300mil

SN74LS640DWR from Texas Instruments, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DIR input Direction control input: high transmits A data to B bus, low transmits B data to A bus (inverted for 'LS640).
2 A1 bidirectional A-bus 3-state I/O 1, with hysteresis at the bus input.
3 A2 bidirectional A-bus 3-state I/O 2, with hysteresis at the bus input.
4 A3 bidirectional A-bus 3-state I/O 3, with hysteresis at the bus input.
5 A4 bidirectional A-bus 3-state I/O 4, with hysteresis at the bus input.
6 A5 bidirectional A-bus 3-state I/O 5, with hysteresis at the bus input.
7 A6 bidirectional A-bus 3-state I/O 6, with hysteresis at the bus input.
8 A7 bidirectional A-bus 3-state I/O 7, with hysteresis at the bus input.
9 A8 bidirectional A-bus 3-state I/O 8, with hysteresis at the bus input.
10 GND power_in Ground.
11 B8 bidirectional B-bus 3-state I/O 8, with hysteresis at the bus input.
12 B7 bidirectional B-bus 3-state I/O 7, with hysteresis at the bus input.
13 B6 bidirectional B-bus 3-state I/O 6, with hysteresis at the bus input.
14 B5 bidirectional B-bus 3-state I/O 5, with hysteresis at the bus input.
15 B4 bidirectional B-bus 3-state I/O 4, with hysteresis at the bus input.
16 B3 bidirectional B-bus 3-state I/O 3, with hysteresis at the bus input.
17 B2 bidirectional B-bus 3-state I/O 2, with hysteresis at the bus input.
18 B1 bidirectional B-bus 3-state I/O 1, with hysteresis at the bus input.
19 G input Active-low enable input; when high the device is disabled and the buses are isolated.
20 VCC power_in Supply voltage.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-20-300mil
Category Logic
Pins 20

CAD (KiCad official)

  • Symbol: SN74LS640DWR
  • Footprint: Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm
  • 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
  • 3D model files: sn74ls640dwr-etched.step / sn74ls640dwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn74ls640dwr.step / sn74ls640dwr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (23 pp, sha256 d6b51fcf6ad079e0, retrieved 2026-10-11, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF