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Contents

README

markdown

MBR230S1F-7

Diodes Incorporated · Schottky Barrier Diodes (SBD) · SOD-123F

MBR230S1F-7 from Diodes Incorporated, in a SOD-123F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOD-123F
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage V(BR) 30 V IR = 1.0 mA 2
Forward Voltage Drop VF 0.37 0.42 V IF = 2A, TA = +25°C 2
Leakage Current IR 0.3 1 mA VR = 30V, TA = +25°C 2
Leakage Current IR 30 mA VR = 30V, TA = +100°C 2
Peak Repetitive Reverse Voltage VRRM 30 V 2
RMS Reverse Voltage VR(RMS) 21 V 2
Average Rectified Output Current IO 2 A 2
Non-Repetitive Peak Forward Surge Current IFSM 30 A 8.3ms single half sine-wave superimposed on rated load 2
Storage Temperature Range TSTG -55 150 °C 2
Operating Temperature Range TJ -55 125 °C 2
Forward Voltage Drop VF 0.31 V IF = 1A, TA = +25°C 2
Forward Voltage Drop VF 0.32 V IF = 2A, TA = +100°C 2
Total Capacitance CT 75 pF VR = 10V, f = 1.0MHz 2
Typical Thermal Resistance Junction to Case RθJC 50 °C/W Note 5: FR-4 substrate, 1" x 1", 2 oz, single-sided, 0.1"*0.15" copper pad 2
Typical Thermal Resistance Junction to Ambient RθJA 120 °C/W Note 5: FR-4 substrate, 1" x 1", 2 oz, single-sided, 0.1"*0.15" copper pad 2
Total Power Dissipation PTOT 0.84 W Note 5: FR-4 substrate, 1" x 1", 2 oz, single-sided, 0.1"*0.15" copper pad 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin • Terminals: Matte Tin Finish annealed over Copper leadframe 1

CAD (KiCad official)

  • Symbol: MBR230S1F-7
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123F (KiCad packages3D, STEP)
  • 3D model files: mbr230s1f-7-etched.step / mbr230s1f-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbr230s1f-7.step / mbr230s1f-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 5beca95c759e0200, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF