component
HX082-P
Public Made by Adomby adom
ZHHXDZ Operational Amplifier, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHX082-P
ZHHXDZ · Operational Amplifier · DIP-8
HX082-P from ZHHXDZ, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT1 | output | Output of amplifier 1. |
| 2 | IN1(-) | input | Inverting input of amplifier 1; input common-mode range is -0.3 to 32 V. |
| 3 | IN1(+) | input | Non-inverting input of amplifier 1; input common-mode range is -0.3 to 32 V. |
| 4 | GND | power_in | Ground / negative supply (V- if split supplies are used). |
| 5 | IN2(+) | input | Non-inverting input of amplifier 2; input common-mode range is -0.3 to 32 V. |
| 6 | IN2(-) | input | Inverting input of amplifier 2; input common-mode range is -0.3 to 32 V. |
| 7 | OUT2 | output | Output of amplifier 2. |
| 8 | VCC | power_in | Positive supply; recommended ±2.5 or 5.0 V to ±15 or 30 V, absolute maximum 32 V single supply or ±16 V split. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ZHHXDZ |
| Package | DIP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Input Offset Voltage | VIO | 9 | mV | VO=1.4V VCC=5.0-30V;RS=0Ω VICM=0V to VCC-1.7V | 2 | ||
| Maximum Input Offset Current | IIO | 150 | nA | VCC=5.0V | 2 | ||
| Maximum Input Bias Current | IIB | -500 | nA | VCC=5.0V | 2 | ||
| Maximum Power Supply Current | ICC | 3 | mA | RL=…,VCC=30V,V0=0V; RL=…,VCC=5V,V0=0V | 2 | ||
| Minimum Large Signal Open-Loop Voltage Gain | AVOL | 15 | V/mV | VCC=15V, RL≥2KΩ | 2 | ||
| Minimum Output High-Level Voltage Swing | VOH | 26 | V | VCC=30V,RL=2KΩ | 2 | ||
| Minimum Output High-Level Voltage Swing | VOH | 27 | V | VCC=30V,RL=10KΩ | 2 | ||
| Maximum Output Low-Level Voltage Swing | VOL | 20 | mV | VCC=5V,RL=10KΩ | 2 | ||
| Maximum Output Short Circuit to GND | ISC | 60 | mA | VCC=5.0V | 2 | ||
| Minimum Source Output Current | Isource | 10 | mA | VIN+=1V, VIN-=0V, VCC=15V,V0=0V | 2 | ||
| Minimum Output Sink Current | Isink | 5 | mA | VIN+=0V, VIN-=1V, VCC=15V,V0=15V | 2 | ||
| Minimum Output Sink Current | Isink | 12 | μA | VIN+=0V, VIN-=1V, VCC=15V, V0=0.2V (a: @25°C) | 2 | ||
| Input Common Mode Voltage Range | VICR | 0 | 28 | V | VCC=30V | 2 | |
| Input Offset Voltage Drift | ΔVIO/ΔT | 7 | μV/。C | RS=0Ω, VCC=30V | 2 | ||
| Input Offset Current Drift | ΔIIO/ΔT | 10 | pA/。C | RS=0Ω, VCC=30V | 2 | ||
| Common Mode Rejection | CMR | 65 | dB | VCC=30V, RS=10KΩ (a: @25°C) | 2 | ||
| Power Supply Rejection | PSR | 65 | dB | VCC=30V | 2 | ||
| Channel Separation | CS | -120 | dB | f=1KHz to 20KHz,VCC=30V (a: @25°C) | 2 | ||
| Operating Temperature, All Package Types | TA | 0 | 70 | °C | All Package Types | 1 | |
| Power Supply Voltages Single Supply | VCC | 32 | V | Single Supply | 2 | ||
| Power Supply Voltages Split Supply | VCC | -16 | 16 | V | Split supplies (printed ±16 V) | 2 | |
| Input Differential Voltage Range | VIDR | -32 | 32 | V | Split Power Supplies (note a) | 2 | |
| Input Common Mode Voltage Range | VICR | -0.3 | 32 | V | 2 | ||
| Junction Temperature | TJ | 150 | °C | 2 | |||
| Storage Temperature | Tstg | -55 | 125 | °C | 2 | ||
| Input Current, per pin | IIN | 50 | mA | per pin; note b: VIN<-0.3V | 2 | ||
| Lead Temperature, 1mm from Case for 10 Seconds | TL | 260 | °C | 1mm from case for 10 seconds | 2 |
CAD (KiCad official)
- Symbol:
HX082-P - Footprint:
Package_DIP:DIP-8_W7.62mm - 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files:
hx082-p-etched.step/hx082-p-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hx082-p.step/hx082-p.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ZHHXDZ datasheet (5 pp, sha256
b03677d615ea166f, retrieved 2026-10-14, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).