component
OSD740
Public Made by Adomby adom
OSEN MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownOSD740
OSEN · MOSFETs · TO-252
OSD740 from OSEN, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate control input with ±30 V maximum gate-source voltage and a 2.0 to 4.0 V threshold at ID=250µA. |
| 2 | Drain | passive | Drain terminal rated 450 V drain-source with 11 A continuous and 44 A pulsed drain current. |
| 3 | Source | passive | Source terminal of the N-channel MOSFET, with a body diode forward voltage of 1.4 V maximum at IS=5A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | OSEN |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 450 | V | ID=250µA, VGS=0V, TJ=25°C | 2 | ||
| Gate Threshold Voltage | VGS(th) | 2 | 4 | V | VDS=VGS, ID=250μA | 2 | |
| Gate-Body Leakage Current | IGSS | -100 | 100 | nA | VGS=±30V, VDS=0 | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | μA | VDS=430V, VGS=0 | 2 | ||
| Forward Transconductance | gfs | 5.8 | S | VDS=15V, ID=5A | 2 | ||
| Total Gate Charge | Qg | 35 | 50 | nC | VDS=250V, VGS=10V, ID=11A | 3 | |
| Diode Forward On-Voltage | VSD | 1.4 | V | IS=5A, VGS=0 | 3 | ||
| Drain-Source Voltage | VDSS | 450 | V | Tc=25°C | 2 | ||
| Gate-Source Voltage-Continuous | VGS | -30 | 30 | V | Tc=25°C | 2 | |
| Drain Current-Continuous | ID | 11 | A | Tc=25°C, Note 2 | 2 | ||
| Drain Current-Single Pulsed | IDM | 44 | A | Tc=25°C, Note 1 | 2 | ||
| Power Dissipation | PD | 56 | W | Tc=25°C, Note 2 | 2 | ||
| Max. Operating Junction Temperature | Tj | 150 | ℃ | Tc=25°C | 2 | ||
| Thermal Resistance, Junction to Case | Rth(j-c) | 2.23 | ℃/W | 3 |
CAD (KiCad official)
- Symbol:
OSD740 - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
osd740-etched.step/osd740-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);osd740.step/osd740.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: OSEN datasheet (3 pp, sha256
1d826251d788e1e3, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).