component
TPS560200DBVT
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Texas Instruments DC-DC Converters, SOT-23-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownTPS560200DBVT
Texas Instruments · DC-DC Converters · SOT-23-5
TPS560200DBVT from Texas Instruments, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | EN | input | Enable pin; float to enable the converter. |
| 2 | GND | power_in | Return for control circuitry and low-side power MOSFET. |
| 3 | PH | output | The switch node of the integrated MOSFET buck converter. |
| 4 | VIN | power_in | Supplies the control circuitry of the power converter. |
| 5 | VSENSE | input | Converter feedback input; connect to the output voltage through a feedback resistor divider. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23-5 |
| Category | Power Management (PMIC) |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage | VIN | -0.3 | 20 | V | 4 | ||
| EN voltage | EN | -0.3 | 7 | V | 4 | ||
| VSENSE voltage | VSENSE | -0.3 | 3 | V | 4 | ||
| PH output voltage | PH | -0.6 | 20 | V | 4 | ||
| PH output voltage transient | PH | -2 | 20 | V | 10-ns transient | 4 | |
| EN source current | -100 | 100 | µA | 4 | |||
| Operating junction temperature | TJ | -40 | 125 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Input voltage range | VI | 4.5 | 17 | V | 4 | ||
| Operating junction temperature | TJ | -40 | 125 | °C | 4 | ||
| VIN operating input voltage | VIN | 4.5 | 17 | V | 4 | ||
| VIN internal UVLO threshold (rising) | VIN | 3.9 | 4.35 | 4.5 | V | VIN Rising | 4 |
| VIN shutdown supply current | IVCCSDN | 2 | 3.7 | 9 | µA | EN = 0 V, VIN = 12 V | 5 |
| VIN operating non-switching supply current | ICC | 35 | 60 | 95 | µA | VSENSE = 850 mV, VIN = 12 V | 5 |
| Voltage reference (pulse-skipping) | 0.796 | 0.804 | 0.812 | V | 25°C, VIN = 12 V, VOUT = 1.05 V, IOUT = 5 mA, Pulse-Skipping | 5 | |
| Voltage reference (continuous current mode, 25°C) | 0.792 | 0.8 | 0.808 | V | 25°C, VIN = 12 V, VOUT = 1.05 V, IOUT = 100 mA, Continuous current mode | 5 | |
| Voltage reference (continuous current mode, over temperature) | 0.789 | 0.8 | 0.811 | V | VIN = 12 V, VOUT = 1.05 V, IOUT = 100 mA, Continuous current mode | 5 | |
| High-side switch resistance | 0.5 | 0.95 | 1.5 | Ω | VIN = 12 V | 5 | |
| Low-side switch resistance | 0.2 | 0.33 | 0.55 | Ω | VIN = 12 V | 5 | |
| Low-side switch sourcing current limit | 550 | 650 | 775 | mA | LOUT = 10 µH, Valley current, VOUT = 1.05 V | 5 | |
| On time | 130 | 165 | 200 | ns | VIN = 12 V | 5 | |
| Output undervoltage protection threshold | 56 | 63 | 69 | %VREF | Falling | 5 | |
| Junction-to-ambient thermal resistance | RθJA | 166.8 | °C/W | DBV 5-pin package | 4 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 100 | °C/W | DBV 5-pin package | 4 | ||
| Junction-to-board thermal resistance | RθJB | 75.5 | °C/W | DBV 5-pin package | 4 | ||
| Junction-to-top characterization parameter | ψJT | 29.2 | °C/W | DBV 5-pin package | 4 | ||
| Junction-to-board characterization parameter | ψJB | 3.7 | °C/W | DBV 5-pin package | 4 | ||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 28.7 | °C/W | DBV 5-pin package | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | See Figure 19 for a PCB layout example. The GND pin should be tied to the PCB ground plane at the pin of the IC. The PH pin should be routed to a small copper area directly adjacent to the pin. Make t | 14 |
CAD (KiCad official)
- Symbol:
TPS560200DBVT - Footprint:
Package_TO_SOT_SMD:SOT-23-5 - 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files:
tps560200dbvt-etched.step/tps560200dbvt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps560200dbvt.step/tps560200dbvt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (23 pp, sha256
89fa68e36f425800, retrieved 2026-11-06, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).