AW20036QNR from AWINIC(Shanghai Awinic Tech), in a QFN-32-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	R1	output	Constant current sink connected to the LED cathode; maximum current per sink is set by IMAX (10 mA, 40 mA or 160 mA settings).
2	R2	output	Constant current sink connected to the LED cathode; maximum current per sink is set by IMAX (10 mA, 40 mA or 160 mA settings).
3	R3	output	Constant current sink connected to the LED cathode; maximum current per sink is set by IMAX (10 mA, 40 mA or 160 mA settings).
4	R4	output	Constant current sink connected to the LED cathode; maximum current per sink is set by IMAX (10 mA, 40 mA or 160 mA settings).
5	R5	output	Constant current sink connected to the LED cathode; maximum current per sink is set by IMAX (10 mA, 40 mA or 160 mA settings).
6	R6	output	Constant current sink connected to the LED cathode; maximum current per sink is set by IMAX (10 mA, 40 mA or 160 mA settings).
7	R7	output	Constant current sink connected to the LED cathode; maximum current per sink is set by IMAX (10 mA, 40 mA or 160 mA settings).
8	R8	output	Constant current sink connected to the LED cathode; maximum current per sink is set by IMAX (10 mA, 40 mA or 160 mA settings).
9	R9	output	Constant current sink connected to the LED cathode; maximum current per sink is set by IMAX (10 mA, 40 mA or 160 mA settings).
10	R10	output	Constant current sink connected to the LED cathode; maximum current per sink is set by IMAX (10 mA, 40 mA or 160 mA settings).
11	R11	output	Constant current sink connected to the LED cathode; maximum current per sink is set by IMAX (10 mA, 40 mA or 160 mA settings).
12	R12	output	Constant current sink connected to the LED cathode; maximum current per sink is set by IMAX (10 mA, 40 mA or 160 mA settings).
13	VBAT	power_in	Power supply input; VBAT supply range is 2.4 V to 5.5 V.
14	NC	unconnected	No connect; must be left floating.
15	NC	unconnected	No connect; must be left floating.
16	NC	unconnected	No connect; must be left floating.
17	NC	unconnected	No connect; must be left floating.
18	NC	unconnected	No connect; must be left floating.
19	NC	unconnected	No connect; must be left floating.
20	C3	output	Current switch connected to the LED anode in matrix display mode; PMOS on-resistance RON is 0.6 Ω to 1 Ω.
21	C2	output	Current switch connected to the LED anode in matrix display mode; PMOS on-resistance RON is 0.6 Ω to 1 Ω.
22	C1	output	Current switch connected to the LED anode in matrix display mode; PMOS on-resistance RON is 0.6 Ω to 1 Ω.
23	VBAT	power_in	Power supply input; VBAT supply range is 2.4 V to 5.5 V.
24	CLKIO	bidirectional	Synchronization pin for clock sharing among multiple devices; internally pulled down to GND with a 1 MΩ resistor.
25	AD	input	I2C address select; connect to GND, VDD, SCL or SDA to select one of four device addresses; internally pulled down to GND with a 1 MΩ resistor.
26	SDA	bidirectional	I2C serial data line; the datasheet text lists this pin as the serial clock input, which conflicts with the pin name (see review_required).
27	SCL	input	I2C serial clock line; the datasheet text lists this pin as serial data I/O, which conflicts with the pin name (see review_required).
28	GND	power_in	Ground; also shown as the exposed pad (28,EP) in the application circuit.
29	VDD	power_in	Power supply input; VDD supply range is 2.4 V to 5.5 V.
30	CBP	power_out	LDO output; must be connected to a bypass capacitor of at least 1μF to GND (printed as '1F' in the source text).
31	INTN	output	Interrupt output, open-drain, active low.
32	HWEN	input	Hardware enable, active high; internally pulled down to GND with a 1 MΩ resistor.
33	GND	power_in	Ground.

Key specifications

Parameter	Value
Manufacturer	AWINIC(Shanghai Awinic Tech)
Package	QFN-32-EP(4x4)
Category	Display Modules / LED Drivers / Display Drivers
Pins	33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
VDD Power supply voltage	VDD	2.4		5.5	V		6
VBAT Power supply voltage	VBAT	2.4		5.5	V		6
Shutdown current of VBAT	ISD_VBAT		0.1	1	μA	HWEN=GND	6
Shutdown current of VDD	ISD_VDD		0.1	1	μA	HWEN=GND	6
Standby current of VBAT	ISB_VBAT	9	18	27	μA	HWEN=VDD	6
Standby current of VDD	ISB_VDD	25	50	75	μA	HWEN=VDD	6
Quiescent current in active mode (VBAT)	IACT_VBAT	15	25	35	μA	VBAT= 4.2V, HWEN=VDD, SLPCR.SLEEP = 0, display off	6
Quiescent current in active mode (VDD)	IACT_VDD	150	225	300	μA	VDD = 2.8V, HWEN=VDD, SLPCR.SLEEP = 0, display off	6
Max current of each current sink(R1~R12)	IMAX-10mA	9	10	11	mA	IMAX[3:0]=0000	6
Max current of each current sink(R1~R12)	IMAX-40mA	37.2	40	42.8	mA	IMAX[3:0]=0011	6
Max current of each current sink(R1~R12)	IMAX-160mA	148.8	160	171.2	mA	IMAX[3:0]=0111	6
Match accuracy at ILED=10mA	IMATCH	-10		10	%	ILED=10mA	6
Match accuracy at ILED=40mA	IMATCH	-6		6	%	ILED=40mA	6
Match accuracy at ILED=160mA	IMATCH	-5		5	%	ILED=160mA	6
Average current on each LED	ILED	11.8	13.1	14.5	mA	IMAX[3:0]=0011, FADEn = 0xFF, DIMn = 0xFF, SIZE.SWSEL = 2	6
Dropout voltage for Rx at ILED=40mA	VDROPOUT	50	100	200	mV	ILED=40mA	6
Dropout voltage for Rx at ILED=160mA	VDROPOUT	90	180	360	mV	ILED=160mA	6
PMOS on-resistance for Cx	RON		0.6	1	Ω		6
OSC clock frequency	FOSC	3.8	4	4.2	MHz		6
Output low level (CLKIO)	VOL			0.2	V	CLKIO, IOL = 7.5mA	7
Input high level (CLKIO, AD, HWEN)	VIH	1.3			V	CLKIO, AD, HWEN	7
Input low level (CLKIO, AD, HWEN)	VIL			0.4	V	CLKIO, AD, HWEN	7
Pull down resistance (CLKIO, AD, HWEN)	RPD		1		MΩ	CLKIO, AD, HWEN	7
Output low level (INTN)	VOL			0.1	V	IOL = 10 mA	7
Output low level (SDA)	VOL			0.1	V	SDA,IOL = 10 mA	7
Input high level (SCL, SDA)	VIH	1.3			V	SCL,SDA	7
Input low level (SCL, SDA)	VIL			0.4	V	SCL,SDA	7
Deglitch time SDA	tDEG_SDA			200	ns		7
Deglitch time SCL	tDEG_SCL			150	ns		7
Supply Voltage Range VDD	VDD	-0.3		5.5	V		5
Supply Voltage Range VBAT	VBAT	-0.3		5.5	V		5
Voltage on CBP		-0.3		2	V		5
Voltage on SCL, SDA, AD, HWEN, INTN, CLKIO		-0.3			V	Upper limit printed as VDD	5
Maximum Power Consumption (PDmax,package)	PDmax			3.84	W	TA=25°C	5
Maximum Junction Temperature	TJMAX			160	°C		5
Storage Temperature	TSTG	-65		150	°C		5
Lead Temperature (Soldering)				260	°C	10 seconds	5
ESD HBM (human body model)		-2000		2000	V	HBM (human body model)	5
ESD CDM		-1500		1500	V	CDM	5
Latch-Up	IT	-200		200	mA	JESD78D	5
Operating temperature range	TA	-40		85	℃	Ordering information temperature range	5
Junction-to-ambient thermal resistance	θJA		30		°C/W		5

CAD (KiCad official)

Symbol: AW20036QNR
Footprint: Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm
3D model: QFN-32-EP(4x4) (KiCad packages3D, STEP)
3D model files: aw20036qnr-etched.step / aw20036qnr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); aw20036qnr.step / aw20036qnr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: AWINIC(Shanghai Awinic Tech) datasheet (40 pp, sha256 e96c4cd72d38b109, retrieved 2026-11-05, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

AW20036QNR

Verified AW20036QNR

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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