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AOZ1031AI
Public Made by Adomby adom
Alpha & Omega Semicon DC-DC Converters, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownAOZ1031AI
Alpha & Omega Semicon · DC-DC Converters · SOIC-8
AOZ1031AI from Alpha & Omega Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PGND | power_in | Power ground, which needs to be electrically connected to AGND. |
| 2 | VIN | power_in | Supply voltage input (4.5V to 18V operating); the device starts up when VIN rises above the UVLO threshold and EN is logic high. |
| 3 | AGND | power_in | Analog ground, the reference point for the controller section, which needs to be electrically connected to PGND. |
| 4 | FB | input | Feedback input used to set the output voltage via a resistive divider between the output and AGND (0.8V reference). |
| 5 | COMP | passive | External loop compensation pin; connect an RC network between COMP and AGND to compensate the control loop. |
| 6 | EN | input | Enable pin; pull to logic high to enable the device and to logic low to disable it, and do not leave it open. |
| 7 | LX | output | Switching node, the PWM output connection to the inductor (pins 7 and 8 are both LX). |
| 8 | LX | output | Switching node, the PWM output connection to the inductor (pins 7 and 8 are both LX). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Alpha & Omega Semicon |
| Package | SOIC-8 |
| Category | Power Supply Chip |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (VIN) | VIN | 20 | V | 3 | |||
| LX to AGND | -0.7 | V | max VIN+0.3V | 3 | |||
| LX to AGND transient | -3 | V | for 20 nS | 3 | |||
| EN to AGND | -0.3 | V | max VIN+0.3V | 3 | |||
| FB to AGND | -0.3 | 6 | V | 3 | |||
| COMP to AGND | -0.3 | 6 | V | 3 | |||
| PGND to AGND | -0.3 | 0.3 | V | 3 | |||
| Junction Temperature | TJ | 150 | °C | 3 | |||
| Storage Temperature | TS | -65 | 150 | °C | 3 | ||
| ESD Rating | 2 | kV | Human body model 1.5kΩ in series with 100pF | 3 | |||
| Supply Voltage (recommended) | VIN | 4.5 | 18 | V | 3 | ||
| Output Voltage Range | VOUT | 0.8 | V | max VIN | 3 | ||
| Ambient Temperature | TA | -40 | 85 | °C | 3 | ||
| Package Thermal Resistance SO-8 | ΘJA | 87 | °C/W | 3 | |||
| Package Thermal Resistance SO-8 | ΘJC | 30 | °C/W | 3 | |||
| Package Power Dissipation SO-8 | PD | 1.15 | W | @ 25°C ambient | 3 | ||
| Supply Voltage | VIN | 4.5 | 18 | V | TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V | 4 | |
| Supply current (Quiescent) | IIN | 1.6 | 2.5 | mA | IOUT = 0, VFB = 1.2V, VEN >1.2V | 4 | |
| Shutdown supply current | IOFF | 1 | 10 | μA | VEN = 0V | 4 | |
| Feedback Voltage | VFB | 0.788 | 0.8 | 0.812 | V | TA = 25°C | 4 |
| Frequency | fO | 500 | 600 | 700 | kHz | 4 | |
| Current Limit | ILIM | 4 | 5 | A | 4 | ||
| High-side switch on-resistance | 80 | 100 | mΩ | VIN = 12V | 4 | ||
| High-side switch on-resistance | 130 | 180 | mΩ | VIN = 5V | 4 | ||
| Low-side switch on-resistance | 30 | 36 | mΩ | VIN = 12V | 4 | ||
| Low-side switch on-resistance | 56 | 70 | mΩ | VIN = 5V | 4 | ||
| Input under-voltage lockout threshold | VUVLO | 4.1 | V | VIN rising | 4 | ||
| Input under-voltage lockout threshold | VUVLO | 3.7 | V | VIN falling | 4 | ||
| Soft Start Interval | tSS | 2.2 | ms | 4 | |||
| Maximum Duty Cycle | DMAX | 100 | % | 4 | |||
| EN input hysteresis | VHYS | 100 | mV | 4 | |||
| Feedback voltage input current | IFB | 200 | nA | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | 1. The LX pins are connected to internal PFET and NFET drains. They are low resistance thermal conduction path and most noisy switching node. Connected a large copper plane to LX pin to help thermal | 11 |
CAD (KiCad official)
- Symbol:
AOZ1031AI - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
aoz1031ai-etched.step/aoz1031ai-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);aoz1031ai.step/aoz1031ai.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Alpha & Omega Semicon datasheet (15 pp, sha256
5135b06a43b0a3e1, retrieved 2026-10-26, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).