component
TMI3286B
Public Made by Adomby adom
TMI DC-DC Converters, ESOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTMI3286B
TMI · DC-DC Converters · ESOP-8
TMI3286B from TMI, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BS | passive | Bootstrap pin; a capacitor connected between LX and BS is required to form a floating supply across the high-side switch driver. |
| 2 | VIN | power_in | Power supply pin; recommended input voltage range is 4.5 V to 18 V. |
| 3 | LX | output | Switching pin; absolute maximum voltage is -0.3 V to 20 V, with transients under 10 ns limited to -4.5 V to 22 V. |
| 4 | GND | power_in | Ground pin. |
| 5 | FB | input | Output voltage feedback input; connect to the center point of the external resistor divider, with absolute maximum voltage of -0.3 V to 6 V. |
| 6 | NC | unconnected | No connection. |
| 7 | EN | input | Drive to logic-high to enable the IC and to logic-low to disable it into micro-power shutdown mode; do not leave EN floating. |
| 8 | NC | unconnected | No connection. |
| 9 | Thermal Pad | power_in | Exposed thermal pad; connect to ground with PCB vias for thermal dissipation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TMI |
| Package | ESOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Supply Voltage, EN | -0.3 | 20 | V | 2 | |||
| LX Voltages | -0.3 | 20 | V | 2 | |||
| LX Voltage (<10ns transient) | -4.5 | 22 | V | <10ns transient | 2 | ||
| FB Voltage | -0.3 | 6 | V | 2 | |||
| BS Voltage | -0.3 | 23 | V | 2 | |||
| Storage Temperature Range | -65 | 150 | °C | 2 | |||
| Junction Temperature | 160 | °C | Note 2 | 2 | |||
| Power Dissipation | 1500 | mW | 2 | ||||
| Lead Temperature (Soldering) | 260 | °C | Soldering, 10s | 2 | |||
| ESD Human Body Model (all pins) | VESD_HBM | -2000 | 2000 | V | JEDEC JS-001 | 3 | |
| ESD Charged Device Model (all pins) | VESD_CDM | -2000 | 2000 | V | JEDEC JS-001 | 3 | |
| Voltage Range IN | 4.5 | 18 | V | 3 | |||
| Operating Junction Temperature | TJ | -40 | 125 | °C | 3 | ||
| Feedback Voltage of TMI3286B | VFB | 0.906 | 0.925 | 0.942 | V | TA=25°C | 4 |
| Shutdown Current | 5 | 10 | μA | VIN=12V, EN=0V | 4 | ||
| High-Side Switch Leakage Current | 1 | 10 | μA | VEN=0V, VLX=0V | 4 | ||
| Oscillation Frequency | 370 | 500 | 650 | kHz | 4 | ||
| On Time | 150 | 200 | 250 | ns | VIN=12V, VOUT=1.2V, IOUT=1A | 4 | |
| Soft Start Time | 0.7 | 1 | 1.3 | ms | 4 | ||
| EN High-Level Input Voltage | 0.85 | 1.05 | 1.2 | V | 4 | ||
| Quiescent Current | 300 | μA | VEN=2V, VFB=VREF x 105% | 4 | |||
| UVLO Rising Threshold | 4 | V | 4 | ||||
| UVLO Hysteresis | 0.45 | V | 4 | ||||
| OVP Threshold | 19.3 | V | 4 | ||||
| High-Side Switch On-Resistance | 60 | mΩ | 4 | ||||
| Low-Side Switch On-Resistance | 35 | mΩ | 4 | ||||
| Switch Valley Current Limit | 4.5 | A | Minimum Duty Cycle | 4 | |||
| Maximum Duty Cycle | 80 | % | 4 | ||||
| Minimum On-Time | 80 | ns | 4 | ||||
| Hiccup on Time | 1.6 | ms | 4 | ||||
| Hiccup Time Before Restart | 6 | ms | 4 | ||||
| EN Hysteresis | 100 | mV | 4 | ||||
| Thermal Shutdown Threshold | 165 | °C | Guaranteed by design (Note 4) | 4 | |||
| Thermal Shutdown Hysteresis | 30 | °C | Guaranteed by design (Note 4) | 4 | |||
| Junction-to-ambient thermal resistance | θJA | 60 | °C/W | JESD51-7, 4-layer PCB (Note 3) | 3 | ||
| Junction-to-case (bottom) thermal resistance | θJC | 9 | °C/W | 3 |
CAD (KiCad official)
- Symbol:
TMI3286B - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm - 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files:
tmi3286b-etched.step/tmi3286b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tmi3286b.step/tmi3286b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TMI datasheet (17 pp, sha256
d75092d658528c31, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).