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Contents

README

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HT7125M3-1

HGSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-3

HT7125M3-1 from HGSEMI, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin (地) for the regulator; the datasheet gives no electrical limit for this pin.
2 VIN power_in Input pin (输入脚); the absolute maximum supply voltage is -0.3 V to +30 V and the input voltage must not exceed 30 V.
3 VOUT power_out Regulated output pin (输出脚); output current is rated up to 100 mA, and the datasheet recommends an output capacitor greater than 2.2 uF to ground.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage VOUT 2.45 2.5 2.55 V VIN=VOUT+2V, IOUT=10mA 3
Output voltage accuracy (feature list) -2 2 % Printed as ±2% output voltage accuracy 1
Output current IOUT 70 100 mA VIN=VOUT+2V 3
Load regulation ΔVOUT 25 60 mV VIN=VOUT+2V, 1mA ≤ IOUT ≤ 50mA 3
Dropout voltage VDIF 2 4 mV IOUT=1mA, △Vo=2% 3
Quiescent current ISS 2 3 uA No load 3
Input voltage line regulation ΔVOUT/ΔVIN×VOUT 0.2 %/V Vo+1V≤VIN≤30V, IOUT=1mA 3
Input voltage VIN 30 V 3
Power supply voltage (absolute maximum) -0.3 30 V 3
Storage temperature range -45 140 ℃ 3
Pin temperature (soldering) 260 ℃ 10 s 3
Operating ambient temperature -40 85 ℃ 3
Output capacitor 2.2 uF Capacitor from output to GND required for phase compensation (ESR); stated in usage notes 6
Thermal resistance, junction to ambient θJA 500 ℃/W SOT-23-3; still air, no heatsink (assumed) 3
Power dissipation PD 0.2 W SOT-23-3; Ta=25℃ 3
Output voltage temperature coefficient ΔVOUT/ΔTa×VOUT 100 ppm/℃ IOUT=10mA, -40℃<Ta<85℃ 4

CAD (KiCad official)

  • Symbol: HT7125M3-1
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: ht7125m3-1-etched.step / ht7125m3-1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ht7125m3-1.step / ht7125m3-1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (10 pp, sha256 84b38fcd63737af2, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF