Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

SM7012

Shenzhen Sunmoon Micro · AC-DC Controllers & Regulators · DIP-8

SM7012 from Shenzhen Sunmoon Micro, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Chip ground and the SOURCE terminal of the internal high-voltage MOSFET; pins 1 and 2 should be connected to a copper pour larger than 8*8mm for heat dissipation.
2 GND power_in Chip ground and the SOURCE terminal of the internal high-voltage MOSFET; pins 1 and 2 should be connected to a copper pour larger than 8*8mm for heat dissipation.
3 FB input Feedback input; FB current above IFBSD (0.9mA typ) turns off PWM and the chip enters burst mode, with maximum FB current rated 3mA.
4 VDD power_in Chip power supply with operating range of 9V to 38V; turn-on threshold 14.5V typ, turn-off threshold 8V typ, overvoltage protection at 39V typ.
5 DRAIN passive DRAIN of the internal high-voltage MOSFET, also used as the startup charging path for the chip, with maximum voltage of 730V (400V during startup).
6 DRAIN passive DRAIN of the internal high-voltage MOSFET, also used as the startup charging path for the chip, with maximum voltage of 730V (400V during startup).
7 DRAIN passive DRAIN of the internal high-voltage MOSFET, also used as the startup charging path for the chip, with maximum voltage of 730V (400V during startup).
8 DRAIN passive DRAIN of the internal high-voltage MOSFET, also used as the startup charging path for the chip, with maximum voltage of 730V (400V during startup).

Key specifications

Parameter Value
Manufacturer Shenzhen Sunmoon Micro
Package DIP-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VDD turn-on voltage VDDON 13 14.5 16 V TA=25℃, VDD=18V 4
VDD turn-off voltage VDDOFF 7 8 9 V TA=25℃, VDD=18V 4
DRAIN off-state leakage current IDSS 0.1 mA 4
Drain-source breakdown voltage BVDS 730 V 4
Drain pin max voltage VDS(max) -0.3 730 V TA=25℃ 3
Drain pin max voltage at startup VDS(ST) -0.3 400 V TA=25℃ 3
Supply voltage VDD -0.3 38 V TA=25℃ 3
Clamp current Ivdd 10 mA TA=25℃ 3
Max feedback current IFB 3 mA TA=25℃ 3
Operating junction temperature TJ -40 150 ℃ TA=25℃ 3
Storage temperature TSTG -55 150 ℃ TA=25℃ 3
Thermal resistance junction-ambient RthJA 45 ℃/W PCB with 200mm2 copper, 35um thick, connected to all GND pins 3
VDD operating voltage VDD 9 38 V 1
On resistance RDS(on) 19 Ohm ID=0.2A 4
VDD hysteresis threshold VDDHYS 6.5 V 4
VDD overvoltage protection threshold VDDOVP 39 V 4
VDD operating current 1 IDD1 0.4 mA IFB=2.0mA 4
VDD operating current 2 IDD2 1 mA IFB=0.5mA; ID=50mA 4
Charging current IDDCH -220 uA VDS=100V; VDD=5V 4
Oscillator frequency FOSC 60 KHz 4
IFB/IDRAIN gain GID 320 4
Peak current threshold ILIMIT 400 mA VFB=0V 4
FB shutdown current IFBSD 0.9 mA 4
FB input resistance RFB 1.23 Kohm ID=0mA 4
Leading edge blanking time TLEB 300 nS 4
Minimum on time TON(min) 700 nS 4
Overtemperature protection temperature TOVT 150 ℃ 4
Overtemperature hysteresis THYS 30 ℃ 4

CAD (KiCad official)

  • Symbol: SM7012
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: sm7012-etched.step / sm7012-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sm7012.step / sm7012.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen Sunmoon Micro datasheet (12 pp, sha256 e6a0ea4a124139f5, retrieved 2026-10-23, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF