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Contents

README

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HT82C251ARZ

HTCSEMI · Buffer/Driver/Transceiver · SOP-8

HT82C251ARZ from HTCSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 TXD input Transmit data input from the CAN controller; low (~1 V) drives the bus dominant, high (~4 V) gives recessive, with VIH min 0.7 VCC and VIL max 0.3 VCC.
2 GND power_in Ground.
3 VCC power_in Supply voltage, 4.5 V to 5.5 V recommended operating range (absolute maximum 7.0 V).
4 RXD output Receive data output to the CAN controller; low when the bus is dominant (VDIFF > 0.9 V), high when recessive (VDIFF < 0.5 V).
5 Vref power_in Reference voltage output equal to half of the supply voltage (0.45 VCC to 0.55 VCC).
6 CANL bidirectional Low-level CAN bus line, with input/output voltage range of -36 V to 36 V and recessive bus voltage of 2.0 V to 3.0 V.
7 CANH bidirectional High-level CAN bus line, with input/output voltage range of -36 V to 36 V and recessive bus voltage of 2.0 V to 3.0 V.
8 RS input Mode select: grounded (VRs < 0.3 VCC) for high-speed, resistor Rext to ground for reduced-RFI slope control, and VRs > 0.75 VCC for standby.

Key specifications

Parameter Value
Manufacturer HTCSEMI
Package SOP-8
Category Logic ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input/output high and low level voltage of CAN signal VCAN -36 36 V 3
Pin 06, 07 transient voltage Vtr -200 200 V 3
Storage temperature Tstg -60 150 °C 3
Junction temperature Tj 150 °C 3
Supply current, dominant I3 78 mA Dominant; V1 = 1,0 V, VCC < 5,1 V 4
Supply current, dominant I3 80 mA Dominant; V1 = 1,0 V, VCC < 5,25 V 4
Supply current, dominant I3 85 mA Dominant; V1 = 1,0 V, VCC < 5,5 V 4
Supply current, recessive I3 10 mA Recessive; V1 = 4,0 V, R8 = 47 kΩ 4
High-level input current IIH -200 30 μA 4,5 V< VCC < 5,5 V, V1 = 4,0 V 4
Low-level input current IIL -200 -100 μA 4,5 V< VCC < 5,5 V, V1 = 1,0 V 4
Recessive bus voltage V6,7 2 3 V 4,5 V< VCC < 5,5 V, V1 = 4,0 V, no load 4
Off-state output leakage current ILO -2 2 mA 4,5 V< VCC < 5,5 V, -2,0 V< (V6, V7) < 7,0 V 4
Off-state output leakage current ILO -10 10 mA 4,5 V< VCC < 5,5 V, -5,0 V< (V6, V7) < 36 V 4
CANH short-circuit current ISC7 -200 mA 4,5 V< VCC < 5,5 V, V7 = -5,0 V 5
CANL signal short-circuit current ISC6 200 mA 4,5 V< VCC < 5,5 V, V6 = 36 V 5
Differential input voltage (dominant mode) VDIFF(D) 1 5 V 4,5 V< VCC < 5,5 V, -7,0 V< (V6, V7) < 12 V 5
CANL and CANH input resistance RI 5 25 kΩ 4,5 V< VCC < 5,5 V 5
Differential input resistance RDIFF 20 100 kΩ 4,5 V< VCC < 5,5 V 5
One bit transmitting minimum time tbit 1 μs 4,5 V< VCC < 5,5 V, R8 = 0 Ω 6
Input data transfer to active bus delay tonTXD 50 ns 4,5 V< VCC < 5,5 V, R8 = 0 Ω 6
Input data transfer to inactive bus delay toffTXD 80 ns 4,5 V< VCC < 5,5 V, R8 = 0 Ω 6
Input data transfer to active receiver delay tonRXD 120 ns 4,5 V< VCC < 5,5 V, R8 = 0 Ω 6
Input data transfer to active receiver delay tonRXD 550 ns 4,5 V< VCC < 5,5 V, R8 = 47 kΩ 6
Input data transfer to inactive receiver delay toffRXD 190 ns 4,5 V< VCC < 5,5 V, R8 = 0 Ω 6
Input data transfer to inactive receiver delay toffRXD 400 ns 4,5 V< VCC < 5,5 V, R8 = 47 kΩ 6
Wake-up time from standby mode (via pin 08) tWAKE 20 μs 4,5 V< VCC < 5,5 V 6
Bus input data transfer delay to low on RXD output tdRXDL 3 μs 4,5 V< VCC < 5,5 V, V8 = 4,0 V 6
Input current for low RFI mode Islope -200 -10 μA 4,5 V< VCC < 5,5 V 6
Differential hysteresis voltage Vdiff(hys) 150 mV VCC from 4,5 to 5,5 V 7
CANH, CANL slew rate /SR/ 7 V/μs VCC from 4,5 to 5,5 V; R8 = 47 kΩ 7
High level CAN short circuit current ISC7 -100 mA VCC from 4,5 to 5,5 V; V7 = -36 V 7

CAD (KiCad official)

  • Symbol: HT82C251ARZ
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: ht82c251arz-etched.step / ht82c251arz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ht82c251arz.step / ht82c251arz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HTCSEMI datasheet (16 pp, sha256 55daffa5715e0cfc, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF