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Contents

README

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GD32F310K6T6

GigaDevice Semicon Beijing · Microcontrollers (MCU/MPU/SOC) · LQFP-32(7x7)

GD32F310K6T6 from GigaDevice Semicon Beijing, in a LQFP-32(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Main digital supply pin; the device operates from a 2.6 to 3.6 V supply.
2 PF0-OSCIN bidirectional 5 V tolerant GPIO PF0 that also serves as the HXTAL oscillator input (OSCIN) and the CTC_SYNC alternate function.
3 PF1-OSCOUT bidirectional 5 V tolerant GPIO PF1 that also serves as the HXTAL oscillator output (OSCOUT).
4 NRST bidirectional Reset pin (NRST) for the device; the datasheet lists it as an I/O with no further function detail in the extracted pages.
5 VDDA power_in Analog supply pin for the ADC and analog circuitry.
6 PA0-WKUP bidirectional GPIO PA0 with USART1_CTS and I2C1_SCL alternates (I2C1 is K8-only), ADC_IN0, RTC_TAMP1 and WKUP0 wake-up functions.
7 PA1 bidirectional GPIO PA1 with USART1_RTS, I2C1_SDA (K8-only), EVENTOUT and ADC_IN1 functions.
8 PA2 bidirectional GPIO PA2 with USART1_TX, TIMER14_CH0 and ADC_IN2 functions.
9 PA3 bidirectional GPIO PA3 with USART1_RX, TIMER14_CH1 and ADC_IN3 functions.
10 PA4 bidirectional GPIO PA4 with SPI0_NSS/I2S0_WS, USART1_CK, TIMER13_CH0, SPI1_NSS (K8-only) and ADC_IN4 functions.
11 PA5 bidirectional GPIO PA5 with SPI0_SCK/I2S0_CK and ADC_IN5 functions.
12 PA6 bidirectional GPIO PA6 with SPI0_MISO/I2S0_MCK, TIMER2_CH0, TIMER0_BRKIN, TIMER15_CH0, EVENTOUT and ADC_IN6 functions.
13 PA7 bidirectional GPIO PA7 with SPI0_MOSI/I2S0_SD, TIMER2_CH1, TIMER13_CH0, TIMER0_CH0_ON, TIMER16_CH0, EVENTOUT and ADC_IN7 functions.
14 PB0 bidirectional GPIO PB0 with TIMER2_CH2, TIMER0_CH1_ON, USART1_RX, EVENTOUT and ADC_IN8 functions.
15 PB1 bidirectional GPIO PB1 with TIMER2_CH3, TIMER13_CH0, TIMER0_CH2_ON, SPI1_SCK (K8-only) and ADC_IN9 functions.
16 VSS power_in Ground pin for the device.
17 VDD power_in Main digital supply pin; the device operates from a 2.6 to 3.6 V supply.
18 PA8 bidirectional 5 V tolerant GPIO PA8 with USART0_CK, TIMER0_CH0, CK_OUT, USART1_TX, EVENTOUT and CTC_SYNC functions.
19 PA9 bidirectional 5 V tolerant GPIO PA9 with USART0_TX, TIMER0_CH1, TIMER14_BRKIN, and I2C0_SCL functions.
20 PA10 bidirectional 5 V tolerant GPIO PA10 with USART0_RX, TIMER0_CH2, TIMER16_BRKIN, and I2C0_SDA functions.
21 PA11 bidirectional 5 V tolerant GPIO PA11 with USART0_CTS, TIMER0_CH3, EVENTOUT and SPI1_IO2 (K8-only) functions.
22 PA12 bidirectional 5 V tolerant GPIO PA12 with USART0_RTS, TIMER0_ETI, EVENTOUT and SPI1_IO3 (K8-only) functions.
23 PA13 bidirectional 5 V tolerant GPIO PA13 with SWDIO, IFRP_OUT and SPI1_MISO (K8-only) functions.
24 PA14 bidirectional 5 V tolerant GPIO PA14 with SWCLK, USART1_TX and SPI1_MOSI (K8-only) functions.
25 PA15 bidirectional 5 V tolerant GPIO PA15 with SPI0_NSS/I2S0_WS, USART1_RX, SPI1_NSS (K8-only) and EVENTOUT functions.
26 PB3 bidirectional 5 V tolerant GPIO PB3 with SPI0_SCK/I2S0_CK and EVENTOUT functions.
27 PB4 bidirectional 5 V tolerant GPIO PB4 with SPI0_MISO/I2S0_MCK, TIMER2_CH0 and EVENTOUT functions.
28 PB5 bidirectional 5 V tolerant GPIO PB5 with SPI0_MOSI/I2S0_SD, I2C0_SMBA, TIMER15_BRKIN, TIMER2_CH1 and WKUP5 wake-up functions.
29 PB6 bidirectional 5 V tolerant GPIO PB6 with I2C0_SCL, USART0_TX and TIMER15_CH0_ON functions.
30 PB7 bidirectional 5 V tolerant GPIO PB7 with I2C0_SDA, USART0_RX and TIMER16_CH0_ON functions.
31 BOOT0 input Boot mode selection input (BOOT0) pin.
32 VSS power_in Ground pin for the device.

Key specifications

Parameter Value
Manufacturer GigaDevice Semicon Beijing
Package LQFP-32(7x7)
Category Embedded Processors & Controllers
Pins 32

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Variations between different VDD power pins /ΔVDDx/ 50 mV 39
Variations between different ground pins /VSSX −VSS/ 50 mV 39
Maximum current for GPIO pin IIO -25 25 mA 39
Operating temperature range TA -40 85 °C 39
Storage temperature range TSTG -65 150 °C 39
Maximum junction temperature TJ 125 °C 39
Power dissipation of LQFP32 PD 724 mW TA = 85°C 39
Supply voltage VDD 2.6 3.3 3.6 V 39
Analog supply voltage VDDA 2.6 3.3 3.6 V Same as VDD 39
Battery supply voltage VBAT 1.8 3.6 V 39
AHB1 clock frequency fHCLK1 0 72 MHz 40
AHB2 clock frequency fHCLK2 0 72 MHz 40
APB1 clock frequency fAPB1 0 36 MHz 40
APB2 clock frequency fAPB2 0 36 MHz 40
VDD rise time rate tVDD 0 μs/V 40
VDD fall time rate 20 μs/V 40
Crystal or ceramic frequency fHXTAL 4 8 32 MHz 2.6 V ≤ VDD ≤ 3.6 V 40
OSCIN high or low time tH/L(HXTAL) 5 ns 41
OSCIN rise or fall time tR/F(HXTAL) 10 ns 41
IRC8M oscillator frequency accuracy, factory-trimmed ACCIRC8M -2 2 % VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C 42
IRC8M oscillator frequency accuracy, factory-trimmed ACCIRC8M -1 1 % VDD = VDDA = 3.3 V, TA = 25 °C 42
IRC28M oscillator frequency accuracy, factory-trimmed ACCIRC28M -4 4 % VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C 43
IRC28M oscillator frequency accuracy, factory-trimmed ACCIRC28M -1 1 % VDD = VDDA = 3.3 V, TA = 25°C 43
IRC48M oscillator frequency accuracy, factory-trimmed ACCIRC48M -4 4 % VDD = VDDA = 3.3 V, TA = -40 °C ~+85 °C 43
IRC48M oscillator frequency accuracy, factory-trimmed ACCIRC48M -2 2 % VDD = VDDA = 3.3 V, TA = 25°C 43
PLL input clock frequency fPLLIN 1 25 MHz 44
Electrostatic discharge voltage (human body model) VESD(HBM) 2000 V TA = 25 °C; JS-001-2017 48
Electrostatic discharge voltage (charge device model) VESD(CDM) 500 V TA = 25 °C; JS-002-2018 48
Static latch-up I-test LU I-test -200 200 mA TA = 25 °C; JESD78D 48
Vsupply over voltage 5.4 V 48
Low level output voltage for 8 IO pins VOL 0.19 V each IIO = +8 mA, VDD = 2.6 V 45
Low level output voltage for 8 IO pins VOL 0.17 V each IIO = +8 mA, VDD = 3.3 V 45

CAD (KiCad official)

  • Symbol: GD32F310K6T6
  • Footprint: Package_QFP:LQFP-32_7x7mm_P0.8mm
  • 3D model: LQFP-32(7x7) (KiCad packages3D, STEP)
  • 3D model files: gd32f310k6t6-etched.step / gd32f310k6t6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gd32f310k6t6.step / gd32f310k6t6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GigaDevice Semicon Beijing datasheet (78 pp, sha256 3a14fd00b701aa9c, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF