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ISO7741FBDWR
Public Made by Adomby adom
Texas Instruments Digital Isolators, SOIC-16-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownISO7741FBDWR
Texas Instruments · Digital Isolators · SOIC-16-300mil
ISO7741FBDWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC1 | power_in | Side 1 supply pin; VCC1 operates from 2.25 V to 5.5 V and should be decoupled to GND1 with 0.1 µF placed close to the pin. |
| 2 | GND1 | power_in | Side 1 ground connection for VCC1 (one of two GND1 pins, both connected together). |
| 3 | INA | input | Channel A data input on side 1; VIH is 0.7 x VCCI minimum and VIL is 0.3 x VCCI maximum. |
| 4 | INB | input | Channel B data input on side 1; VIH is 0.7 x VCCI minimum and VIL is 0.3 x VCCI maximum. |
| 5 | INC | input | Channel C data input on side 1; VIH is 0.7 x VCCI minimum and VIL is 0.3 x VCCI maximum. |
| 6 | OUTD | output | Channel D output on side 1 (the reverse-direction channel of ISO7741, whose input IND is on pin 11); output drives to VCCO with VOH of at least VCCO - 0.4 V and VOL of at most 0.4 V at 5 V. |
| 7 | EN1 | input | Output enable for side 1: when EN1 is high or open the side 1 outputs are enabled, and when EN1 is low they are forced to high impedance. |
| 8 | GND1 | power_in | Side 1 ground connection for VCC1 (one of two GND1 pins, both connected together). |
| 9 | GND2 | power_in | Side 2 ground connection for VCC2 (one of two GND2 pins, both connected together). |
| 10 | EN2 | input | Output enable for side 2: when EN2 is high or open the side 2 outputs are enabled, and when EN2 is low they are forced to high impedance. |
| 11 | IND | input | Channel D data input on side 2 (the reverse-direction channel of ISO7741); VIH is 0.7 x VCCI minimum and VIL is 0.3 x VCCI maximum. |
| 12 | OUTC | output | Channel C output on side 2; VOH is at least VCCO - 0.4 V and VOL is at most 0.4 V at 5 V. |
| 13 | OUTB | output | Channel B output on side 2; VOH is at least VCCO - 0.4 V and VOL is at most 0.4 V at 5 V. |
| 14 | OUTA | output | Channel A output on side 2; VOH is at least VCCO - 0.4 V and VOL is at most 0.4 V at 5 V. |
| 15 | GND2 | power_in | Side 2 ground connection for VCC2 (one of two GND2 pins, both connected together). |
| 16 | VCC2 | power_in | Side 2 supply pin; VCC2 operates from 2.25 V to 5.5 V and should be decoupled to GND2 with 0.1 µF placed close to the pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16-300mil |
| Category | Signal Isolation Devices |
| Pins | 16 |
CAD (KiCad official)
- Symbol:
ISO7741FBDWR - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files:
iso7741fbdwr-etched.step/iso7741fbdwr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);iso7741fbdwr.step/iso7741fbdwr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (51 pp, sha256
d6ac6b90609c88c4, retrieved 2026-10-08, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).