component
CMS30I30A
Public Made by Adomby adom
TOSHIBA Schottky Barrier Diodes (SBD), SOD-128. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownCMS30I30A
TOSHIBA · Schottky Barrier Diodes (SBD) · SOD-128
CMS30I30A from TOSHIBA, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TOSHIBA |
| Package | SOD-128 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak forward voltage | VFM(3) | 0.4 | 0.49 | V | IFM = 3 A (pulse measurement) | 2 | |
| Repetitive peak reverse current | IRRM(2) | 28 | 100 | µA | VRRM = 30 V (pulse measurement) | 2 | |
| Repetitive peak reverse voltage | VRRM | 30 | V | 1 | |||
| Average forward current | IF(AV) | 3 | A | Note 1: Tℓ = 102 °C, square wave (α = 180°), VR = 15 V | 1 | ||
| Non-repetitive peak forward surge current | IFSM | 30 | A | Note 2: f = 50 Hz, half-sine wave | 1 | ||
| Junction temperature | Tj | 150 | °C | 1 | |||
| Storage temperature | Tstg | -55 | 150 | °C | 1 | ||
| Thermal resistance (junction-to-ambient) | Rth(j-a) | 60 | °C/W | Device mounted on a ceramic board (board size 50 mm × 50 mm), soldering land size 2 mm × 2 mm, board thickness 0.64 mm | 2 | ||
| Thermal resistance (junction-to-ambient) | Rth(j-a) | 135 | °C/W | Device mounted on a glass-epoxy board (board size 50 mm × 50 mm), soldering land size 6 mm × 6 mm, board thickness 1.6 mm | 2 | ||
| Thermal resistance (junction-to-lead) | Rth(j-ℓ) | 16 | °C/W | Junction to cathode lead | 2 | ||
| Junction temperature (recommended) | Tj | 120 | °C | Recommended to keep junction temperature below this value (usage considerations) | 3 |
CAD (KiCad official)
- Symbol:
CMS30I30A - Footprint:
Diode_SMD:D_SOD-128 - 3D model: SOD-128 (KiCad packages3D, STEP)
- 3D model files:
cms30i30a-etched.step/cms30i30a-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cms30i30a.step/cms30i30a.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TOSHIBA datasheet (7 pp, sha256
86af0113beb4693b, retrieved 2026-10-21, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).