component
TPS40009DGQR
Public Made by Adomby adom
Texas Instruments DC-DC Converters, HVSSOP-10. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS40009DGQR
Texas Instruments · DC-DC Converters · HVSSOP-10
TPS40009DGQR from Texas Instruments, in a HVSSOP-10. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ILIM | input | Current-sink input (15 µA) for overcurrent threshold; external resistor sets voltage between (VDD−0.8) V and VDD. |
| 2 | FB | input | Feedback input to error amplifier; regulated voltage is 700 mV internal reference. |
| 3 | COMP | output | Error amplifier output for PWM duty-cycle modulation. |
| 4 | SS/SD | input | Soft-start and shutdown input with 3-µA charge current; shutdown occurs when voltage falls below 0.25 V. |
| 5 | GND | power_in | Power supply return and PowerPAD heat slug connection point. |
| 6 | LDRV | output | Low-side MOSFET gate driver output with 10-35 ns rise/fall times. |
| 7 | VDD | power_in | Power supply input, 2.25-5.5 V range; decouple with ≥1-µF low-ESR capacitor. |
| 8 | SW | output | Switched node connection for overcurrent and predictive gate-drive delay sensing; high-side driver return path. |
| 9 | HDRV | output | High-side MOSFET gate driver output bootstrapped to approximately 2 × VDD with 10-35 ns rise/fall times. |
| 10 | BOOT | output | Bootstrap supply output (VSW + 6.5 V maximum) for high-side gate driver charging. |
| 11 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HVSSOP-10 |
| Category | Power Management (PMIC) |
| Pins | 11 |
CAD (KiCad official)
- Symbol:
TPS40009DGQR - Footprint:
Package_SO:HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.83x1.89mm - 3D model: HVSSOP-10, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
tps40009dgqr-etched.step/tps40009dgqr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps40009dgqr.step/tps40009dgqr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (30 pp, sha256
23bd0ed211cc6eb5, retrieved 2026-10-07, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).