component
LM26420XMHX
Public Made by Adomby adom
Texas Instruments DC-DC Converters, HTSSOP-20-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM26420XMHX
Texas Instruments · DC-DC Converters · HTSSOP-20-EP
LM26420XMHX from Texas Instruments, in a HTSSOP-20-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VINC | power_in | Input supply for control circuitry. |
| 2 | EN1 | input | Logic high enable operation for Buck 1; do not allow this pin to float or be greater than VIN + 0.3 V. |
| 3 | VIND1 | power_in | Power input supply for Buck 1. |
| 4 | VIND1 | power_in | Power input supply for Buck 1. |
| 5 | SW1 | output | Output switch for Buck 1; connect to the inductor. |
| 6 | PGND1 | power_in | Power ground pin for Buck 1. |
| 7 | PGND1 | power_in | Power ground pin for Buck 1. |
| 8 | FB1 | input | Feedback pin for Buck 1; connect to external resistor divider to set output voltage. |
| 9 | PG1 | output | Power Good indicator for Buck 1; connected through a resistor to an external supply (open drain output). |
| 10 | DAP | passive | Die Attach Pad; connect to system ground for low thermal impedance, but it cannot be used as a primary GND connection. |
| 11 | DAP | passive | Die Attach Pad; connect to system ground for low thermal impedance, but it cannot be used as a primary GND connection. |
| 12 | PG2 | output | Power Good indicator for Buck 2; connected through a resistor to an external supply (open drain output). |
| 13 | FB2 | input | Feedback pin for Buck 2; connect to external resistor divider to set output voltage. |
| 14 | PGND2 | power_in | Power ground pin for Buck 2. |
| 15 | PGND2 | power_in | Power ground pin for Buck 2. |
| 16 | SW2 | output | Output switch for Buck 2; connect to the inductor. |
| 17 | VIND2 | power_in | Power input supply for Buck 2. |
| 18 | VIND2 | power_in | Power input supply for Buck 2. |
| 19 | EN2 | input | Logic high enable operation for Buck 2; do not allow this pin to float or be greater than VIN + 0.3 V. |
| 20 | AGND | power_in | Signal ground pin; place the bottom resistor of the feedback network as close as possible to this pin. |
| 21 | DAP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HTSSOP-20-EP |
| Category | Power Management ICs |
| Pins | 21 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage VIN | VIN | -0.5 | 7 | V | 6 | ||
| FB voltage | FB | -0.5 | 3 | V | 6 | ||
| EN voltage | EN | -0.5 | 7 | V | 6 | ||
| SW output voltage | SW | -0.5 | 7 | V | 6 | ||
| Soldering information | 220 | °C | Infrared or convection reflow (15 sec) | 6 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 6 | ||
| ESD HBM | V(ESD) | -2000 | 2000 | V | Human-body model, ANSI/ESDA/JEDEC JS-001 | 6 | |
| ESD CDM | V(ESD) | -750 | 750 | V | Charged-device model, JESD22-C101 | 6 | |
| Input voltage | VIN | 3 | 5.5 | V | 6 | ||
| Junction temperature (Q1) | TJ | -40 | 125 | °C | Q1 | 6 | |
| Junction temperature (Q0) | TJ | -40 | 150 | °C | Q0 | 6 | |
| Junction-to-ambient thermal resistance | RθJA | 38.5 | °C/W | PWP (HTSSOP) 20 pins | 6 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 21 | °C/W | PWP (HTSSOP) 20 pins | 6 | ||
| Junction-to-board thermal resistance | RθJB | 19.9 | °C/W | PWP (HTSSOP) 20 pins | 6 | ||
| Junction-to-top characterization parameter | ψJT | 0.7 | °C/W | PWP (HTSSOP) 20 pins | 6 | ||
| Junction-to-board characterization parameter | ψJB | 19.7 | °C/W | PWP (HTSSOP) 20 pins | 6 | ||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 3.5 | °C/W | PWP (HTSSOP) 20 pins | 6 | ||
| Feedback voltage | VFB | 0.788 | 0.8 | 0.812 | V | 7 | |
| Feedback voltage line regulation | ΔVFB/VIN | 0.05 | %/V | VIN = 3 V to 5.5 V | 7 | ||
| Feedback input bias current | IB | 0.4 | 100 | nA | 7 | ||
| Undervoltage lockout, rising | UVLO | 2.628 | 2.9 | V | VIN Rising | 7 | |
| Undervoltage lockout, falling | UVLO | 2 | 2.3 | V | VIN Falling | 7 | |
| UVLO hysteresis | UVLO | 330 | mV | 7 | |||
| Switching frequency | FSW | 1.85 | 2.2 | 2.65 | MHz | LM26420-X | 7 |
| Frequency foldback | FFB | 300 | kHz | LM26420-X | 7 | ||
| Maximum duty cycle | DMAX | 86 | 91.5 | % | LM26420-X | 7 | |
| Top switch on resistance | RDSON_TOP | 70 | 135 | mΩ | HTSSOP-20 Package | 7 | |
| Bottom switch on resistance | RDSON_BOT | 45 | 80 | mΩ | TSSOP-20 Package | 7 | |
| Top switch current limit | ICL_TOP | 2.4 | 3.3 | A | VIN = 3.3 V | 7 | |
| Bottom switch reverse current limit | ICL_BOT | 0.4 | 0.75 | A | VIN = 3.3 V | 7 | |
| Phase shift between SW1 and SW2 | ΔΦ | 160 | 180 | 200 | ° | 7 | |
| Enable threshold voltage | VEN_TH | 0.97 | 1.04 | 1.12 | V | 7 | |
| Enable threshold hysteresis | VEN_TH | 0.15 | V | 7 | |||
| Switch leakage | ISW_TOP | -0.7 | µA | 7 | |||
| Enable pin current sink/source | IEN | 5 | nA | 7 | |||
| Upper power good threshold | VPG-TH-U | 848 | 925 | 1008 | mV | FB Pin Voltage Rising | 7 |
| Upper power good hysteresis | 40 | mV | 7 | ||||
| Lower power good threshold | VPG-TH-L | 656 | 710 | 791 | mV | FB Pin Voltage Rising | 7 |
| Lower power good hysteresis | 40 | mV | 7 | ||||
| VINC quiescent current (non-switching) | IQVINC | 3.3 | 5 | mA | LM26420X/Y, VFB = 0.9 V, both outputs on | 7 | |
| VINC quiescent current (switching) | IQVINC | 4.7 | 6.2 | mA | LM26420X/Y, VFB = 0.7 V, both outputs on | 7 | |
| VINC quiescent current (shutdown) | IQVINC | 0.05 | µA | All Options, VEN = 0 V | 7 | ||
| VIND quiescent current (non-switching) | IQVIND | 0.9 | 1.5 | mA | LM26420X/Y, VFB = 0.9 V | 7 | |
| VIND quiescent current (switching) | IQVIND | 11 | 15 | mA | LM26420X, VFB = 0.7 V | 7 | |
| VIND quiescent current (shutdown) | IQVIND | 0.1 | µA | All Options, VEN = 0 V | 7 | ||
| Thermal shutdown temperature | TSD | 165 | °C | 7 |
CAD (KiCad official)
- Symbol:
LM26420XMHX - Footprint:
Package_SO:TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm - 3D model: HTSSOP-20-EP (KiCad packages3D, STEP)
- 3D model files:
lm26420xmhx-etched.step/lm26420xmhx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm26420xmhx.step/lm26420xmhx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (47 pp, sha256
31980aecd87c6fe7, retrieved 2026-10-31, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).