component
ES1F
Public Made by Adomby adom
ONSEMI Global Sourcing Parts, SMA(DO-214AC). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownES1F
ONSEMI · Global Sourcing Parts · SMA(DO-214AC)
ES1F from ONSEMI, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE | passive | Cathode terminal of the rectifier diode; the color band on the SMA package denotes the cathode. |
| 2 | ANODE | passive | Anode terminal of the rectifier diode, opposite the cathode band. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ONSEMI |
| Package | SMA(DO-214AC) |
| Category | Global Sourcing Parts |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Forward Voltage | VF | 1.3 | V | @ IF = 1.0 A | 1 | ||
| Maximum Reverse Current, TA = 25C | IR | 5 | A | @ rated VR, TA = 25C | 1 | ||
| Maximum Reverse Current, TA = 100C | IR | 100 | A | @ rated VR, TA = 100C | 1 | ||
| Maximum Reverse Recovery Time | Trr | 35 | ns | IF = 0.5 A, IR = 1.0 A, IRR = 0.25 A | 1 | ||
| Typical Junction Capacitance | Cj | 10 | pF | VR = 4.0 V, f = 1.0 MHz | 1 | ||
| Maximum Repetitive Reverse Voltage | VRRM | 300 | V | 1 | |||
| Average Rectified Forward Current | IF(AV) | 1 | A | 1 | |||
| Non-repetitive Peak Forward Surge Current | IFSM | 30 | A | 8.3 ms single half-sine-wave (JEDEC method) | 1 | ||
| Operating Junction Temperature Range | TJ | -55 | 150 | °C | 1 | ||
| Storage Temperature Range | TSTG | -55 | 150 | °C | 1 | ||
| Power Dissipation | PD | 1.47 | W | 1 | |||
| Thermal Resistance, Junction-to-Ambient | RθJA | 85 | °C/W | PCB mounted on 0.2 in x 0.2 in (5 x 5 mm) copper pad area (Note 1) | 1 | ||
| Thermal Resistance, Junction-to-Case | RθJC | 61 | °C/W | PCB mounted on 0.2 in x 0.2 in (5 x 5 mm) copper pad area (Note 1) | 1 | ||
| Thermal Resistance, Junction-to-Lead | RθJL | 35 | °C/W | PCB mounted on 0.2 in x 0.2 in (5 x 5 mm) copper pad area (Note 1) | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | RθJL Thermal Resistance, Junction−to−Lead (Note 1) 35 °C/W 1. P. C. B mounted on 0.2″ × 0.2″ (5 × 5 mm) copper Pad Area. | 1 |
CAD (KiCad official)
- Symbol:
ES1F - Footprint:
Diode_SMD:D_SMA - 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files:
es1f-etched.step/es1f-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);es1f.step/es1f.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ONSEMI datasheet (4 pp, sha256
f8a8cefa6cfcdb8e, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).