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Contents

README

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AGM01P15D

AGM-Semi · MOSFETs · TO-252

AGM01P15D from AGM-Semi, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±20 V, with threshold VGS(th) of -1.2 V min to -2.2 V max at ID=-250µA.
2 D passive Drain, also connected to the exposed tab; VDS rated -100 V and continuous drain current -7.9 A at Tc=25℃ (package limited).
3 S passive Source; body diode source-drain current rated -7.9 A with forward voltage max -1.2 V at IS=-6A.

Key specifications

Parameter Value
Manufacturer AGM-Semi
Package TO-252
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage (VGS=0V) VDS -100 V VGS=0V 1
Gate-Source Voltage (VDS=0V) VGS -20 20 V VDS=0V 1
Drain Current-Continuous ID -7.9 A Tc=25℃ (Note 1) 1
Drain Current-Continuous ID -5.6 A Tc=100℃ 1
Drain Current-Pulsed IDM (pluse) -31.6 A Note 2 1
Maximum Power Dissipation PD 33 w Tc=25℃ 1
Maximum Power Dissipation PD 13 w Tc=100℃ 1
Avalanche energy EAS 56 mJ Note 3 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance Junction-ambient (Steady State) RθJA 50 ℃/W Steady State, Note 1 1
Thermal Resistance Junction-Case RθJC 3.75 ℃/W 1
Drain-Source Breakdown Voltage BVDSS -100 V VGS=0V ID=-250μA 2
Zero Gate Voltage Drain Current IDSS -1 μA VDS=-100V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) -1.2 -1.7 -2.2 V VDS=VGS,ID=-250μA 2
Drain-Source On-State Resistance RDS(on) 315 340 mΩ VGS=-10V, ID=-6A 2
Drain-Source On-State Resistance RDS(on) 297 330 mΩ VGS=-4.5V, ID=-3A 2
Source-Drain Current (Body Diode) ISD -7.9 A 2
Forward on Voltage VSD -1.2 V VGS=0V,IS=-6A 2

CAD (KiCad official)

  • Symbol: AGM01P15D
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: agm01p15d-etched.step / agm01p15d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); agm01p15d.step / agm01p15d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AGM-Semi datasheet (8 pp, sha256 b3a6f0938135ae86, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF