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FDC3512-VB

Public Made by Adom

by adom

VBsemi Elec MOSFETs, TSOP-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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FDC3512-VB

VBsemi Elec · MOSFETs · TSOP-6

FDC3512-VB from VBsemi Elec, in a TSOP-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 D passive Drain, internally connected to the other drain pins; VDS rated 100 V.
2 D passive Drain, internally connected to the other drain pins; continuous drain current 3.2 A at TC = 25 °C (package limited).
3 G input Gate; VGS rated ±20 V, threshold 1.0 to 2.5 V at ID = 250 µA.
4 S passive Source; continuous source-drain diode current 2.1 A at TC = 25 °C.
5 D passive Drain, internally connected to the other drain pins; pulsed drain current 25 A (t = 300 µs).
6 D passive Drain, internally connected to the other drain pins; RDS(on) 0.095 Ω at VGS = 10 V.

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package TSOP-6
Category Transistors/Thyristors
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 100 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID 3.2 A TJ = 150 °C, TC = 25 °C 1
Continuous Drain Current ID 2.8 A TJ = 150 °C, TC = 70 °C 1
Continuous Drain Current ID 3 A TA = 25 °C, notes b, c 1
Continuous Drain Current ID 2.4 A TA = 70 °C, notes b, c 1
Pulsed Drain Current IDM 25 A t = 300 µs 1
Continuous Source-Drain Diode Current IS 2.1 A TC = 25 °C 1
Continuous Source-Drain Diode Current IS 1.1 A TA = 25 °C, notes b, c 1
Maximum Power Dissipation PD 2.5 W TC = 25 °C 1
Maximum Power Dissipation PD 1.6 W TC = 70 °C 1
Maximum Power Dissipation PD 1.3 W TA = 25 °C, notes b, c 1
Maximum Power Dissipation PD 0.8 W TA = 70 °C, notes b, c 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Soldering Recommendations (Peak Temperature) 260 °C peak temperature 1
Maximum Junction-to-Ambient RthJA 75 100 °C/W t ≤ 5 s, notes b, d 1
Maximum Junction-to-Ambient (steady state) RthJA 166 °C/W steady state, note d 1
Maximum Junction-to-Foot (Drain) RthJF 40 50 °C/W steady state 1
Drain-Source Breakdown Voltage VDS 100 V VGS = 0 V, ID = 250 µA 2
Gate-Source Threshold Voltage VGS(th) 1 2.5 V VDS = VGS, ID = 250 µA 2
Gate-Source Leakage IGSS -100 100 nA VDS = 0 V, VGS = ±20 V 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS = 100 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS 10 µA VDS = 100 V, VGS = 0 V, TJ = 70 °C 2
On-State Drain Current ID(on) 20 A VDS 5 V, VGS = 10 V 2
Drain-Source On-State Resistance RDS(on) 0.095 Ω VGS = 10 V, ID = 3.0 A 2
Drain-Source On-State Resistance RDS(on) 0.105 Ω VGS = 4.5 V, ID = 2 A 2
Total Gate Charge Qg 8.2 13 nC VDS = 50 V, VGS = 10 V, ID = 3.0 A 2
Total Gate Charge Qg 4.2 7 nC VDS = 50 V, VGS = 4.5 V, ID = 3.0 A 2
Gate Resistance Rg 2.5 12.6 25.2 Ω f = 1 MHz 2
Rise Time (VGEN = 4.5 V) tr 20 30 ns VDD = 50 V, RL = 3.4 Ω, ID 4.4 A, VGEN = 4.5 V, Rg = 1 Ω 2
Turn-Off Delay Time (VGEN = 4.5 V) td(off) 14 21 ns VDD = 50 V, RL = 3.4 Ω, ID 4.4 A, VGEN = 4.5 V, Rg = 1 Ω 2
Fall Time (VGEN = 4.5 V) tf 10 20 ns VDD = 50 V, RL = 3.4 Ω, ID 4.4 A, VGEN = 4.5 V, Rg = 1 Ω 2
Turn-On Delay Time (VGEN = 10 V) td(on) 3 6 ns VDD = 50 V, RL = 3.4 Ω, ID 2.4 A, VGEN = 10 V, Rg = 1 Ω 2
Rise Time (VGEN = 10 V) tr 11 20 ns VDD = 50 V, RL = 3.4 Ω, ID 2.4 A, VGEN = 10 V, Rg = 1 Ω 2
Turn-Off Delay Time (VGEN = 10 V) td(off) 20 30 ns VDD = 50 V, RL = 3.4 Ω, ID 2.4 A, VGEN = 10 V, Rg = 1 Ω 2
Fall Time (VGEN = 10 V) tf 7 14 ns VDD = 50 V, RL = 3.4 Ω, ID 2.4 A, VGEN = 10 V, Rg = 1 Ω 2
Continuous Source-Drain Diode Current IS 2.1 A TC = 25 °C 2
Pulse Diode Forward Current ISM 25 A 2
Body Diode Voltage VSD 0.82 1.2 V IS = 2.4 A, VGS = 0 V 2
Body Diode Reverse Recovery Time trr 13 20 ns IF = 2.4 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 6 12 nC IF = 2.4 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Drain-Source Breakdown Voltage Temperature Coefficient VDS/TJ 30 mV/°C ID = 250 µA 2
Gate-Source Threshold Voltage Temperature Coefficient VGS(th)/TJ -4.8 mV/°C 2

CAD (KiCad official)

  • Symbol: FDC3512-VB
  • Footprint: Package_SO:TSOP-6_1.65x3.05mm_P0.95mm
  • 3D model: TSOP-6 (KiCad packages3D, STEP)
  • 3D model files: fdc3512-vb-etched.step / fdc3512-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fdc3512-vb.step / fdc3512-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (9 pp, sha256 1067bff1a9446ee9, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF