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Contents

README

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SMCJ30CA-TR

STMicroelectronics · TVS · SMC(DO-214AB)

SMCJ30CA-TR from STMicroelectronics, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Terminal 1 passive Bidirectional Transil terminal with no polarity (SMCJ30CA): stand-off voltage VRM 30 V, breakdown 33.3 V min to 35.1 V max at 1 mA, clamping 48.4 V at 32 A (10/1000 µs).
2 Terminal 2 passive Second bidirectional Transil terminal, interchangeable with terminal 1 (no cathode band on CA types), with 1500 W peak pulse power (10/1000 µs) and IRM max 0.2 µA at 25 °C.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMC(DO-214AB)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Leakage current at 25 °C (unidirectional/bidirectional, SMCJ30CA) IRM 0.2 µA @VRM = 30 V, 25 °C 3
Leakage current at 85 °C (SMCJ30CA) IRM 1 µA @VRM = 30 V, 85 °C 3
Breakdown voltage, minimum (SMCJ30CA) VBR 33.3 V @IR = 1 mA, pulse test tp < 50 ms, 25 °C 3
Breakdown voltage, maximum (SMCJ30CA) VBR 35.1 V @IR = 1 mA, pulse test tp < 50 ms, 25 °C 3
Clamping voltage, 10/1000 µs surge (SMCJ30CA) VCL 48.4 V 10/1000 µs, IPP = 32 A 3
Clamping voltage, 8/20 µs surge (SMCJ30CA) VCL 64.3 V 8/20 µs, IPP = 156 A 3
Peak pulse power dissipation PPP 1500 W 10/1000 µs, Tj initial = Tamb 2
Storage temperature range Tstg -65 150 °C 2
Operating junction temperature range Tj -55 150 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2
Thermal resistance junction to leads Rth(j-l) 15 °C/W Junction to leads 2
Thermal resistance junction to ambient Rth(j-a) 90 °C/W Junction to ambient on printed circuit on recommended pad layout 2

CAD (KiCad official)

  • Symbol: SMCJ30CA-TR
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
  • 3D model files: smcj30ca-tr-etched.step / smcj30ca-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smcj30ca-tr.step / smcj30ca-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (10 pp, sha256 3e2a8c449f34f529, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF