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Contents

README

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SK6018D4-33

Suntek · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · XDFN-4-EP(1x1)

SK6018D4-33 from Suntek, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT power_out Regulated LDO output, programmable from 1.2V to 3.6V in 0.1V steps (3.3V for this -33 version), rated for up to 300mA per the features list with a 350mA current limit.
2 GND power_in Ground reference for the regulator, connected to the thermal pad.
3 EN input Active-high enable input that must not be left floating; VENH is 1.2V minimum and VENL is 0.4V maximum, with input current up to 1.0µA.
4 VIN power_in Power input with a recommended supply range of 2.5V to 6.5V and an absolute maximum of -0.3V to 8V.
5 GND passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Suntek
Package XDFN-4-EP(1x1)
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage tolerance VOUT -2 2 % IOUT=1mA 3
Input Voltage VIN 6.5 V 3
Quiescent Current IQ 1 2 µA VOUT=3.3V, IOUT=0 3
Current Limit I LIMIT 350 mA VIN-VOUT=0.5V 3
Dropout Voltage VDROP 110 mV VOUT=3.3V, IOUT=100mA 3
Dropout Voltage VDROP 230 mV VOUT=3.3V, IOUT=200mA 3
Line Regulation ΔVLINE 0.01 %/V VIN=2.7~5.5V, IOUT=1mA 3
Load Regulation ΔVLOAD 100 mV VOUT=3.3V, IOUT=1~300mA 3
Short Current I SHORT 90 mA VEN=VIN,VOUT Short to GND with 1Ω 3
Shut-down Current I SHDN 0.1 1 µA VEN=0V 3
EN Logic High Voltage VENH 1.2 V VIN=5.5V, IOUT=1mA 3
EN Logic Low Voltage VENL 0.4 V VIN=5.5V, VOUT=0V 3
EN Input Current IEN 1 µA VEN= 0 to 5.5V 3
Supply Voltage VIN 2.5 6.5 V 3
Operating Temperature TOPT -40 85 ℃ 3
Input Voltage VIN -0.3 8 V 2
Output Current IOUT 350 mA 2
Power Dissipation PDMAX 0.6 W DFN1x1_4L 2
Junction Temperature TJ -40 125 ℃ 2
Ambient Temperature TA -40 85 ℃ 2
Storage Temperature TSTG -55 150 ℃ 2
Package Lead Soldering Temperature TSOLDER 260 ℃ 10s 2
Thermal Resistance, junction to ambient RθJA 250 ℃/W DFN1x1_4L 2

CAD (KiCad official)

  • Symbol: SK6018D4-33
  • Footprint: Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
  • 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
  • 3D model files: sk6018d4-33-etched.step / sk6018d4-33-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sk6018d4-33.step / sk6018d4-33.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Suntek datasheet (8 pp, sha256 002cedb5c832923a, retrieved 2026-10-09, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF