component
TPA3111D1QPWPRQ1
Public Unreviewedby Ray
Texas Instruments Audio Power OpAmps, HTSSOP-28. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPA3111D1QPWPRQ1
Texas Instruments · Audio Power OpAmps · HTSSOP-28
TPA3111D1QPWPRQ1 from Texas Instruments, in a HTSSOP-28. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SD | input | Active-low shutdown logic input for the audio amplifier. LOW = outputs Hi-Z, HIGH = outputs enabled. TTL logic levels referenced to AVCC (VIH >= 2 V, VIL <= 0.8 V). |
| 2 | FAULT | output | Open-drain, active-low output that indicates short-circuit or DC-detect fault status. Voltage compliant to AVCC; typically pulled up with 100 kΩ. |
| 3 | GND | power_in | Device ground reference. Connect to local ground plane. |
| 4 | GND | power_in | Device ground reference. Connect to local ground plane. |
| 5 | GAIN0 | input | Gain-select least-significant bit. TTL logic levels with compliance to AVCC. Together with GAIN1 selects one of four fixed gain settings (20/26/32/36 dB typ). |
| 6 | GAIN1 | input | Gain-select most-significant bit. TTL logic levels with compliance to AVCC. Together with GAIN0 selects one of four fixed gain settings (20/26/32/36 dB typ). |
| 7 | AVCC | power_in | Analog supply. Operating range 8 V to 26 V (absolute max 30 V). |
| 8 | AGND | power_in | Analog supply ground. Connect to the thermal pad. |
| 9 | GVDD | power_out | High-side FET gate-drive supply, nominal 7 V (6.5-7.3 V, IGVDD = 2 mA). May also supply the PLIMIT divider. Bypass with a 1 µF capacitor to ground. |
| 10 | PLIMIT | input | Power-limit level adjust input. Connect directly to GVDD for no power limiting; add a 1 µF capacitor to ground. Absolute-max input range −0.3 V to GVDD + 0.3 V. |
| 11 | INN | input | Negative differential audio input, internally biased at 3 V. AC-couple through an input capacitor. |
| 12 | INP | input | Positive differential audio input, internally biased at 3 V. AC-couple through an input capacitor. |
| 13 | NC | unconnected | Not connected. Leave floating or tie to ground per PCB preference. |
| 14 | AVCC | power_in | Analog supply. Connect to the same AVCC net as pin 7 (8-26 V). |
| 15 | PVCC | power_in | H-bridge power supply, 8 V to 26 V (absolute max 30 V). PVCC pins are also connected internally; bypass locally with bulk and ceramic capacitance. |
| 16 | PVCC | power_in | H-bridge power supply, 8 V to 26 V. Tied internally to the other PVCC pins. |
| 17 | BSP | passive | Bootstrap I/O for the positive-side (OUTP) high-side FET. Connect a bootstrap capacitor between BSP and OUTP. |
| 18 | OUTP | output | Class-D H-bridge positive output. Drives the speaker through an LC or ferrite-bead filter (bridge-tied load, min 3.2 Ω, typical 4 Ω or 8 Ω). |
| 19 | PGND | power_in | Power ground for the H-bridges. Provide a low-inductance return to the PVCC decoupling capacitors. |
| 20 | OUTP | output | Class-D H-bridge positive output (paralleled with pin 18 internally). |
| 21 | BSP | passive | Bootstrap I/O for the positive-side high-side FET (paralleled with pin 17). |
| 22 | BSN | passive | Bootstrap I/O for the negative-side (OUTN) high-side FET. Connect a bootstrap capacitor between BSN and OUTN. |
| 23 | OUTN | output | Class-D H-bridge negative output. Drives the return leg of the bridge-tied speaker load through the output filter. |
| 24 | PGND | power_in | Power ground for the H-bridges. |
| 25 | OUTN | output | Class-D H-bridge negative output (paralleled with pin 23 internally). |
| 26 | BSN | passive | Bootstrap I/O for the negative-side high-side FET (paralleled with pin 22). |
| 27 | PVCC | power_in | H-bridge power supply, 8 V to 26 V. Tied internally to the other PVCC pins. |
| 28 | PVCC | power_in | H-bridge power supply, 8 V to 26 V. Tied internally to the other PVCC pins. |
| 29 | PowerPAD | power_in | Exposed thermal pad on the underside of the package. Must be soldered to a thermally dissipating ground plane; also acts as the analog ground return (AGND connects here). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HTSSOP-28 |
| Category | Op-amp/Cmp |
| Pins | 29 |
Ordering variants
Same part, different packaging or reel option.
TPA3111D1QPWPRQ1
CAD (KiCad official)
- Symbol:
TPA3111D1QPWPRQ1 - Footprint:
Package_SO:HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm - 3D model: HTSSOP-28 (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (31 pp, sha256
71e18a79f5ab2f68, retrieved 2026-08-17, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).