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Contents

README

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HGC5615IM

HGSEMI · Digital To Analog Converters (DAC) · SOP-8

HGC5615IM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DIN input Serial data input; the 16-bit word is clocked in most significant bit first on the rising edge of SCLK while CS is low.
2 SCLK input Serial clock input that shifts data into the input register on its rising edge; CS transitions should occur while SCLK is low.
3 CS input Chip select, active low; data is read in while CS is low and the rising edge of CS transfers the data to the DAC register.
4 DOUT output Serial data output for daisy chaining; DIN data appears at DOUT delayed by 16 clock cycles plus one clock width.
5 AGND power_in Analog ground; the recommended ground connection is to the system analog ground plane, with a 0.1µF ceramic bypass between VDD and AGND.
6 REFIN input Reference input (buffered, high impedance) that sets the DAC full-scale output at 2 times the reference voltage; Vref range is 2V to VDD-2V.
7 OUT output DAC analog voltage output, rail-to-rail buffered with short-circuit protection, which can drive a 2k load with 100pF load capacitance.
8 VDD power_in Positive power supply, 4.5V to 5.5V (5V nominal) referenced to AGND.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Data Acquisition
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Integral nonlinearity, end point adjusted (INL) INL -1 1 LSB Vref=2.048V 5
Differential nonlinearity (DNL) DNL -0.5 0.1 0.5 LSB Vref=2.048V 5
Zero-scale error (offset error at zero scale) EZS -3 3 LSB Vref=2.048V 5
Gain error EG -3 3 LSB Vref=2.048V 5
Voltage output range VO 0 V RL= 10k 6
Output voltage, low-level VOL(low) 0.25 V IO(OUT)≤5mA 6
Output voltage, high-level VOH(high) 4.75 V IO(OUT)≤- 5mA 6
Input voltage (REFIN) VI 0 V 6
High-level digital input voltage VIH 2.4 V 6
Low-level digital input voltage VIL 0.8 V 6
High-level digital input current IIH -1 1 µA VI = VDD 6
Low-level digital input current IIL -1 1 µA VI = 0 6
Output voltage, low-level (DOUT) VOL 0.4 V IO = 2mA 6
Supply voltage VDD 4.5 5 5.5 V 6
Power supply current IDD 150 250 µA VDD = 5.5V, No load, All inputs=0V or VDD, Vref = 0 6
Power supply current IDD 230 350 µA VDD = 5.5V, No load, All inputs=0V or VDD, Vref = 2.048V 6
Setup time, DIN before SCLK high tsu(DS) 45 ns 6
Hold time, DIN valid after SCLK high th(DH) 0 ns 6
Setup time, CS low to SCLK high tsu(CSS) 1 ns 6
Setup time, CS high to SCLK high tsu(CS1) 50 ns 6
Hold time, SCLK low to CS low th(CSH0) 1 ns 6
Hold time, SCLK low to CS high th(CSH1) 0 ns 6
Pulse duration, minimum chip select pulse width high tw(CS) 20 ns 6
Pulse duration, SCLK low tw(CL) 25 ns 6
Pulse duration, SCLK high tw(CH) 25 ns 6
Supply voltage (VDD to AGND) VDD 7 V 4
Digital input voltage range to AGND -0.3 V 4
Reference input voltage range to AGND -0.3 V 4
Continuous current at any terminal 20 mA 4
Operating free-air temperature range, TA (HGC5615I) TA -40 85 °C 4
Storage temperature range Tstg -65 150 °C 4
Lead temperature 260 °C 1.6mm (1/16 inch) from case for 10 seconds 4
Supply voltage, VDD VDD 4.5 5 5.5 V 4
High-level digital input voltage VIH 2.4 V 4
Low-level digital input voltage VIL 0.8 V 4
Reference voltage, Vref to REFIN terminal Vref 2 2.048 V 4
Load resistance RL 2 kΩ 4
Operating free-air temperature, TA (HGC5615I) TA -40 85 °C 4

CAD (KiCad official)

  • Symbol: HGC5615IM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hgc5615im-etched.step / hgc5615im-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hgc5615im.step / hgc5615im.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (19 pp, sha256 4f15d178132b78e6, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF