component
TK13P25D
Public Made by Adomby adom
TOSHIBA AMERICA ELECTRONIC COMPONENTS Global Sourcing Parts, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
README
markdownTK13P25D
TOSHIBA AMERICA ELECTRONIC COMPONENTS · Global Sourcing Parts · TO-252
TK13P25D from TOSHIBA AMERICA ELECTRONIC COMPONENTS, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±20 V (VGSS) with threshold Vth of 1.5 to 3.5 V at VDS = 10 V, ID = 1 mA. |
| 2 | D | passive | Drain; drain-source voltage up to 250 V (VDSS) and DC drain current up to 13 A (pulsed 52 A). |
| 3 | S | passive | Source; connects to the source side of the MOSFET and body diode (reverse drain current IDR 13 A DC). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TOSHIBA AMERICA ELECTRONIC COMPONENTS |
| Package | TO-252 |
| Category | Global Sourcing Parts |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate leakage current | IGSS | -1 | 1 | µA | VGS = ±20 V, VDS = 0 V | 3 | |
| Drain cut-off current | IDSS | 10 | µA | VDS = 250 V, VGS = 0 V | 3 | ||
| Drain-source breakdown voltage | V(BR)DSS | 250 | V | ID = 10 mA, VGS = 0 V | 3 | ||
| Gate threshold voltage | Vth | 1.5 | 3.5 | V | VDS = 10 V, ID = 1 mA | 3 | |
| Drain-source on-resistance | RDS(ON) | 0.19 | 0.25 | Ω | VGS = 10 V, ID = 6.5 A | 3 | |
| Diode forward voltage | VDSF | -1.7 | V | IDR = 13 A, VGS = 0 V | 3 | ||
| Drain-source voltage | VDSS | 250 | V | Ta = 25 | 1 | ||
| Gate-source voltage | VGSS | -20 | 20 | V | Ta = 25 | 1 | |
| Drain current (DC) | ID | 13 | A | Tc = 25 | 1 | ||
| Drain current (pulsed) | IDP | 52 | A | Note 1 | 1 | ||
| Power dissipation | PD | 96 | W | Tc = 25 | 1 | ||
| Single-pulse avalanche energy | EAS | 78 | mJ | Note 2: VDD = 50 V, Tch = 25 (initial), L = 0.77 mH, RG = 25 Ω, IAR = 13 A | 1 | ||
| Avalanche current | IAR | 13 | A | Note 1 | 1 | ||
| Reverse drain current (DC) | IDR | 13 | A | 1 | |||
| Reverse drain current (pulsed) | IDRP | 52 | A | Note 1 | 1 | ||
| Channel temperature | Tch | 150 | °C | 1 | |||
| Storage temperature | Tstg | -55 | 150 | °C | 1 | ||
| Channel-to-case thermal resistance | Rth(ch-c) | 1.3 | °C/W | 2 | |||
| Channel-to-ambient thermal resistance | Rth(ch-a) | 125 | °C/W | 2 | |||
| Input capacitance | Ciss | 1100 | pF | VDS = 100 V, VGS = 0 V, f = 1 MHz | 3 | ||
| Reverse transfer capacitance | Crss | 8 | pF | VDS = 100 V, VGS = 0 V, f = 1 MHz | 3 | ||
| Output capacitance | Coss | 66 | pF | VDS = 100 V, VGS = 0 V, f = 1 MHz | 3 | ||
| Gate resistance | rg | 5 | Ω | VDS = OPEN, f = 1 MHz | 3 | ||
| Switching time (rise time) | tr | 40 | ns | See Figure 6.2.1. | 3 | ||
| Switching time (turn-on time) | ton | 55 | ns | See Figure 6.2.1. | 3 | ||
| Switching time (fall time) | tf | 20 | ns | See Figure 6.2.1. | 3 | ||
| Switching time (turn-off time) | toff | 130 | ns | See Figure 6.2.1. | 3 | ||
| Total gate charge | Qg | 25 | nC | VDD ≈ 200 V, VGS = 10 V, ID = 13 A | 3 | ||
| Gate-source charge 1 | Qgs1 | 4.2 | nC | VDD ≈ 200 V, VGS = 10 V, ID = 13 A | 3 | ||
| Gate-drain charge | Qgd | 8.5 | nC | VDD ≈ 200 V, VGS = 10 V, ID = 13 A | 3 | ||
| Reverse recovery time | trr | 180 | ns | IDR = 13 A, VGS = 0 V, -dIDR/dt = 100 A/µs | 3 | ||
| Reverse recovery charge | Qrr | 1.1 | µC | IDR = 13 A, VGS = 0 V, -dIDR/dt = 100 A/µs | 3 | ||
| Peak reverse recovery current | Irr | 12 | A | IDR = 13 A, VGS = 0 V, -dIDR/dt = 100 A/µs | 3 |
CAD (KiCad official)
- Symbol:
TK13P25D - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
tk13p25d-etched.step/tk13p25d-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tk13p25d.step/tk13p25d.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TOSHIBA AMERICA ELECTRONIC COMPONENTS datasheet (9 pp, sha256
b458d0bbdf628640, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).