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Contents

README

markdown

LM258DR2G

onsemi · Operational Amplifier · SOIC-8

LM258DR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUTA output Output of amplifier A. Push-pull class-AB output; output-high limit typ 3.5 V at V_CC=5 V, R_L=2 kΩ; short-circuit current typ 40 mA.
2 INA- input Inverting input of amplifier A. Input bias current typ -45 nA; common-mode range 0 V to V_CC-1.7 V; V_IDR up to ±32 V without damage.
3 INA+ input Non-inverting input of amplifier A. Input bias current typ -45 nA; common-mode range includes V_EE (ground).
4 VEE/GND power_in Negative supply / ground. Ground in single-supply operation; connect to negative rail (-1.5 V to -16 V) in split-supply operation.
5 INB+ input Non-inverting input of amplifier B. Input bias current typ -45 nA; common-mode range includes V_EE (ground).
6 INB- input Inverting input of amplifier B. Input bias current typ -45 nA; V_IDR up to ±32 V without damage.
7 OUTB output Output of amplifier B. Push-pull class-AB output; short-circuit protected; typical source/sink 40/20 mA.
8 VCC power_in Positive supply. 3.0 V to 32 V single-supply, or +1.5 V to +16 V split-supply. Quiescent current typ 0.7 mA at V_CC=5 V.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-8
Category Op-amp/Cmp
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • LM258DR2G
  • LM258DR2GDG
  • LM258DR2GVDG
  • LM258DR2GN
  • LM258DR2GAN
  • LM258DR2GVN
  • LM258DR2GDMR2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage VIO 2 5 mV TA = 25°C 4
Input Offset Voltage VIO 7 mV TA = Thigh 4
Input Offset Current IIO 3 30 nA 4
Input Offset Current IIO 100 nA TA = Thigh to Tlow 4
Input Bias Current IIB -45 -150 nA 4
Input Bias Current IIB -50 -300 nA TA = Thigh to Tlow 4
Input Common Mode Voltage Range VICR 0 28.3 V VCC = 30 V 4
Input Common Mode Voltage Range VICR 0 28 V VCC = 30 V, TA = Thigh to Tlow 4
Large Signal Open Loop Voltage Gain AVOL 50 100 V/mV RL = 2.0 k, VCC = 15 V, For Large VO Swing 4
Large Signal Open Loop Voltage Gain AVOL 25 V/mV TA = Thigh to Tlow 4
Common Mode Rejection CMR 70 85 dB RS ≤ 10 k 4
Power Supply Rejection PSR 65 100 dB 4
Output Voltage-High Limit VOH 3.3 3.5 V VCC = 5.0 V, RL = 2.0 k, TA = 25°C 4
Output Voltage-High Limit VOH 26 V VCC = 30 V, RL = 2.0 k 4
Output Voltage-High Limit VOH 27 28 V VCC = 30 V, RL = 10 k 4
Output Voltage-Low Limit VOL 5 20 mV VCC = 5.0 V, RL = 10 k 4
Output Source Current IO+ 20 40 mA VID = +1.0 V, VCC = 15 V 4
Output Sink Current IO- 10 20 mA VID = -1.0 V, VCC = 15 V 4
Output Sink Current IO- 12 50 A VID = -1.0 V, VO = 200 mV 4
Output Short Circuit to Ground ISC 40 60 mA 4
Power Supply Current (Total Device) ICC 1.5 3 mA VCC = 30 V, VO = 0 V, RL = ∞ 4
Power Supply Current (Total Device) ICC 0.7 1.2 mA VCC = 5 V, VO = 0 V, RL = ∞ 4
Single Supply Voltage VCC 32 Vdc Single supply 3
Split Supply Voltage VCC, VEE -16 16 Vdc Split power supplies 3
Input Differential Voltage Range VIDR -32 32 Vdc 3
Input Common Mode Voltage Range VICR -0.3 32 Vdc 3
Junction Temperature TJ 150 °C 3
Storage Temperature Range Tstg -65 150 °C 3
Operating Ambient Temperature Range (LM258) TA -25 85 °C LM258 3
ESD Protection, Human Body Model HBM 2000 V All other devices 3
ESD Protection, Machine Model MM 200 V All other devices 3
Thermal Resistance, Junction-to-Air (Case 751) RJA 212 °C/W Case 751 (SOIC-8) 3
Thermal Resistance, Junction-to-Case (Case 751) RJC 72 °C/W Case 751 3
Thermal Resistance, Junction-to-Board (Case 751) RJB 74 °C/W Case 751 3
Single Supply Operating Voltage VCC 3 32 V Single supply operation (from Features text) 1

CAD (KiCad official)

  • Symbol: LM258DR2G
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: lm258dr2g-etched.step / lm258dr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm258dr2g.step / lm258dr2g.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
lm258dr2g.step 122 KB You want the bare part, or you mark your own boards.
lm258dr2g-etched.step 2.1 MB You want the part with LM258DR2G already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 510 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (16 pp, sha256 a04e7d41dff19b89, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF