component
3.0SMBJ58CA
Public Made by Adomby adom
BORN TVS, DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdown3.0SMBJ58CA
BORN · TVS · DO-214AA(SMB)
3.0SMBJ58CA from BORN, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | DO-214AA(SMB) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VR | 58 | V | Peak off-state voltage; bidirectional 3.0SMBJ58CA row | 3 | ||
| Breakdown Voltage | VBR | 60.4 | 71.2 | V | VBR@IT, IT = 1 mA | 3 | |
| Maximum Clamping Voltage | VC | 93.6 | V | VC @ Ipp = 32.1 A | 3 | ||
| Maximum Peak Pulse Current | IPP | 32.1 | A | 3 | |||
| Maximum Reverse Leakage Current | IR | 1 | uA | IR @ VR = 58 V | 3 | ||
| Peak Pulse Power Dissipation | PPPM | 3000 | W | Non-repetitive 10/1000us waveform (Note1,2) | 2 | ||
| Steady State Power Dissipation | PD | 6.5 | W | Infinite HeatSink at TA = 50°C (Note3) | 2 | ||
| Peak Forward Surge Current | IFSM | 300 | A | Measured on 8.3ms single half sine wave or equivalent square wave, duty cycle=4 per minute maximum (Note4) | 2 | ||
| Operating Temperature Range | TJ | -55 | 150 | °C | 2 | ||
| Storage Temperature Range | TSTG | -55 | 150 | °C | 2 | ||
| Typical Thermal Resistance Junction to Lead | RθJL | 15 | °C/W | Typical | 2 | ||
| Typical Thermal Resistance Junction to Ambient | RθJA | 75 | °C/W | Typical | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | • Lead Finish: Matte Tin • Case Material: Epoxy Molding Compound | 1 |
CAD (KiCad official)
- Symbol:
3.0SMBJ58CA - Footprint:
Diode_SMD:D_SMB - 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files:
3-0smbj58ca-etched.step/3-0smbj58ca-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);3-0smbj58ca.step/3-0smbj58ca.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BORN datasheet (6 pp, sha256
814bb344cf3cf9e4, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).