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AiP74LVC1G00GC353.TR
Public Made by Adomby adom
Wuxi I core Elec Logic Gates, SOT-353. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAiP74LVC1G00GC353.TR
Wuxi I core Elec · Logic Gates · SOT-353
AiP74LVC1G00GC353.TR from Wuxi I core Elec, in a SOT-353. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | B | input | Data input B of the NAND gate; the datasheet states inputs accept voltages up to 5V, with recommended input voltage 0 to 5.5V. |
| 2 | A | input | Data input A of the NAND gate; the datasheet states inputs accept voltages up to 5V, with recommended input voltage 0 to 5.5V. |
| 3 | GND | power_in | Ground (0V) reference for all voltages on the device. |
| 4 | Y | output | Data output of the NAND gate; in active mode the output voltage is limited to 0 to VCC and the output current is ±50mA absolute maximum. |
| 5 | VCC | power_in | Supply voltage; recommended range is 1.65V to 5.5V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Wuxi I core Elec |
| Package | SOT-353 |
| Category | Logic |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| supply voltage | VCC | -0.5 | 6.5 | V | 4 | ||
| input clamping current | IIK | -50 | mA | VI < 0V | 4 | ||
| input voltage | VI | -0.5 | 6.5 | V | 4 | ||
| output clamping current | IOK | -50 | 50 | mA | VO > VCC or VO < 0V | 4 | |
| output voltage | VO | -0.5 | V | Active mode | 4 | ||
| output voltage | VO | -0.5 | 6.5 | V | Power-down mode | 4 | |
| output current | IO | -50 | 50 | mA | VO=0V to VCC | 4 | |
| supply current | ICC | 100 | mA | 4 | |||
| ground current | IGND | -100 | mA | 4 | |||
| storage temperature | Tstg | -65 | 150 | ℃ | 4 | ||
| total power dissipation | Ptot | 250 | mW | 4 | |||
| soldering temperature | TL | 250 | ℃ | 10s | 4 | ||
| supply voltage | VCC | 1.65 | 5.5 | V | 4 | ||
| input voltage | VI | 0 | 5.5 | V | 4 | ||
| output voltage | VO | 0 | V | Active mode | 4 | ||
| output voltage | VO | 0 | 5.5 | V | Power-down mode; VCC=0V | 4 | |
| ambient temperature | Tamb | -40 | 105 | ℃ | 4 | ||
| input transition rise and fall rate | Δt/ΔV | 20 | ns/V | VCC=1.65V to 2.7V | 4 | ||
| input transition rise and fall rate | Δt/ΔV | 10 | ns/V | VCC=2.7V to 5.5V | 4 | ||
| HIGH-level input voltage | VIH | 1.7 | V | Tamb=-40℃ to +105℃; VCC=2.3V to 2.7V | 6 | ||
| HIGH-level input voltage | VIH | 2 | V | Tamb=-40℃ to +105℃; VCC=2.7V to 3.6V | 6 | ||
| LOW-level input voltage | VIL | 0.7 | V | Tamb=-40℃ to +105℃; VCC=2.3V to 2.7V | 6 | ||
| LOW-level input voltage | VIL | 0.8 | V | Tamb=-40℃ to +105℃; VCC=2.7V to 3.6V | 6 | ||
| HIGH-level output voltage | VOH | 0.95 | V | Tamb=-40℃ to +105℃; IO=-4mA; VCC=1.65V | 6 | ||
| HIGH-level output voltage | VOH | 1.7 | V | Tamb=-40℃ to +105℃; IO=-8mA; VCC=2.3V | 6 | ||
| HIGH-level output voltage | VOH | 1.9 | V | Tamb=-40℃ to +105℃; IO=-12mA; VCC=2.7V | 6 | ||
| HIGH-level output voltage | VOH | 2 | V | Tamb=-40℃ to +105℃; IO=-24mA; VCC=3.0V | 6 | ||
| HIGH-level output voltage | VOH | 3.4 | V | Tamb=-40℃ to +105℃; IO=-32mA; VCC=4.5V | 6 | ||
| LOW-level output voltage | VOL | 0.1 | V | Tamb=-40℃ to +105℃; IO=100uA; VCC=1.65V to 5.5V | 6 | ||
| LOW-level output voltage | VOL | 0.7 | V | Tamb=-40℃ to +105℃; IO=4mA; VCC=1.65V | 6 | ||
| LOW-level output voltage | VOL | 0.45 | V | Tamb=-40℃ to +105℃; IO=8mA; VCC=2.3V | 6 | ||
| LOW-level output voltage | VOL | 0.6 | V | Tamb=-40℃ to +105℃; IO=12mA; VCC=2.7V | 6 | ||
| LOW-level output voltage | VOL | 0.8 | V | Tamb=-40℃ to +105℃; IO=24mA; VCC=3.0V | 6 | ||
| input leakage current | II | -1 | 1 | uA | Tamb=-40℃ to +105℃; VI=5.5V or GND; VCC=0V to 5.5V | 6 | |
| power-off leakage current | IOFF | -2 | 2 | uA | Tamb=-40℃ to +105℃; VI or VO=5.5V; VCC=0V | 6 | |
| supply current | ICC | 4 | uA | Tamb=-40℃ to +105℃; VI=5.5V or GND; IO=0A; VCC=1.65V to 5.5V | 6 | ||
| additional supply current | ΔICC | 500 | uA | Tamb=-40℃ to +105℃; per pin; VI=VCC-0.6V; IO=0A; VCC=2.3V to 5.5V | 6 | ||
| A, B to Y propagation delay | tpd | 1 | 10.5 | ns | Tamb=-40℃ to +105℃; see Figure 5; VCC=1.65V to 1.95V | 7 | |
| A, B to Y propagation delay | tpd | 0.5 | 7 | ns | Tamb=-40℃ to +105℃; see Figure 5; VCC=2.3V to 2.7V | 7 | |
| A, B to Y propagation delay | tpd | 0.5 | 7.5 | ns | Tamb=-40℃ to +105℃; see Figure 5; VCC=2.7V | 7 | |
| A, B to Y propagation delay | tpd | 0.5 | 6 | ns | Tamb=-40℃ to +105℃; see Figure 5; VCC=3.0V to 3.6V | 7 | |
| A, B to Y propagation delay | tpd | 0.5 | 5.5 | ns | Tamb=-40℃ to +105℃; see Figure 5; VCC=4.5V to 5.5V | 7 |
CAD (KiCad official)
- Symbol:
AiP74LVC1G00GC353.TR - Footprint:
Package_TO_SOT_SMD:SOT-353_SC-70-5 - 3D model: SOT-353 (KiCad packages3D, STEP)
- 3D model files:
aip74lvc1g00gc353-tr-etched.step/aip74lvc1g00gc353-tr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);aip74lvc1g00gc353-tr.step/aip74lvc1g00gc353-tr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Wuxi I core Elec datasheet (12 pp, sha256
ea8285749b5ca2d4, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).