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Contents

README

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W25Q128FVSIG

Winbond Elec · NOR FLASH · SOIC-8-208mil

W25Q128FVSIG from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Chip Select Input - active low control signal; device is selected for operation when /CS is low, deselected when high with serial data output pins in high impedance state.
2 DO (IO1) bidirectional Data Output / Data Input Output 1 - serial data output in standard SPI mode on falling edge of CLK; becomes bidirectional IO1 pin in Dual/Quad SPI modes when used for address or data I/O.
3 /WP (IO2) bidirectional Write Protect Input / Data Input Output 2 - active low hardware write protect input that prevents Status Register writes in standard and Dual SPI operation; becomes IO2 pin in Quad SPI when QE bit is set.
4 GND power_in Ground - power supply ground connection for 128M-bit serial flash memory.
5 DI (IO0) bidirectional Data Input / Data Input Output 0 - serial data input in standard SPI mode sampled on rising edge of CLK for instructions, addresses, and data; becomes bidirectional IO0 pin in Dual/Quad SPI modes.
6 CLK input Serial Clock Input - timing clock for serial input and output operations; supports DC to 104 MHz frequency for Fast Read and Quad instructions, DC to 50 MHz for Read Data (03h) instruction.
7 /HOLD or /RESET (IO3) bidirectional Hold or Reset Input / Data Input Output 3 - in Standard/Dual SPI with QE=0, active low hold input pauses device operation or reset input requires ≥1 µs low pulse; becomes IO3 pin in Quad SPI when QE bit is set.
8 VCC power_in Power Supply - supply voltage input operating range 2.7V to 3.6V required for device operation with active current 4 mA typical and standby current 10-50 µA.

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package SOIC-8-208mil
Category Memory
Pins 8

CAD (KiCad official)

  • Symbol: W25Q128FVSIG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8-208mil (KiCad packages3D, STEP)
  • 3D model files: w25q128fvsig-etched.step / w25q128fvsig-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25q128fvsig.step / w25q128fvsig.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (99 pp, sha256 828506b99e659636, retrieved 2026-09-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF