Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

HG809TM3

HGSEMI · Supervisor And Reset ICs · SOT-23-3

HG809TM3 from HGSEMI, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Chip ground terminal; the datasheet gives no voltage limit for this pin.
2 RESET output Reset output (VRESET); with VCC=Vthmin and ISINK=1.2mA, VOL is at most 0.3V, and with VCC>Vthmax and ISOURCE=500uA, VOH is at least 0.8VCC.
3 VCC power_in Chip supply input, operating range 1.0V to 6.0V, with an absolute maximum of 6.5V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating voltage (VCC) VCC 1 6 V 2
Power-up reset time (R/S/T variant) Trp 80 350 ms VCC=0to3.5V,空载 3
Reset voltage temperature coefficient ΔVth/(Vth*ΔTa) -150 150 ppm/℃ -40℃≤Ta≤85℃ 3
Reset output low voltage VOL 0.3 V VCC=Vthmin,ISINK=1.2mA 3
Reset output high voltage VOH 0.8 V VCC>Vthmax,ISOURCE=500uA; printed limit is 0.8VCC 3
Input voltage (VCC) absolute maximum VCC 6.5 V 3
Reset output voltage (VRESET) VRESET -0.3 V printed range -0.3 to VCC+0.3 3
Power dissipation PD 200 mW SOT-23 3
Operating temperature range Tw -40 85 ℃ 3
Storage temperature range Tc -55 125 ℃ 3
Operating junction temperature range Tj -40 85 ℃ 3
Soldering temperature Th 260 ℃ 10s 3

CAD (KiCad official)

  • Symbol: HG809TM3
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: hg809tm3-etched.step / hg809tm3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg809tm3.step / hg809tm3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (6 pp, sha256 4dd29334cac9e274, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF