component
REF192GSZ-REEL7
Public Made by Adomby adom
Analog Devices Voltage Reference, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownREF192GSZ-REEL7
Analog Devices · Voltage Reference · SOIC-8
REF192GSZ-REEL7 from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | TP | unconnected | Factory test point reserved for in-package Zener zap trimming; leave unconnected, no user connection. |
| 2 | VS | power_in | Supply input; the REF19x provides a stable output from supplies as low as 100 mV above the output voltage. |
| 3 | SLEEP | input | Sleep mode control; a low TTL or CMOS level turns the output off and reduces supply current to less than 15 μA maximum. |
| 4 | GND | power_in | Ground connection. |
| 5 | TP | unconnected | Factory test point reserved for in-package Zener zap trimming; leave unconnected, no user connection. |
| 6 | OUTPUT | output | Reference voltage output, 2.50 V nominal for REF192, with up to 30 mA output current and short-circuit protection. |
| 7 | NC | unconnected | No connect. |
| 8 | NC | unconnected | No connect. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Initial accuracy, G grade (REF192 @ TA = 25°C) | VO | 2.49 | 2.5 | 2.51 | V | IOUT = 0 mA | 6 |
| Temperature coefficient, G grade (−40°C ≤ TA ≤ +85°C) | TCVO/°C | 10 | 25 | ppm/°C | IOUT = 0 mA | 7 | |
| Temperature coefficient, G grade (−40°C ≤ TA ≤ +125°C) | TCVO/°C | 10 | ppm/°C | IOUT = 0 mA | 7 | ||
| Line regulation, F and G grades (25°C) | ΔVO/ΔVIN | 4 | 8 | ppm/V | 6 | ||
| Line regulation, F and G grades (−40°C ≤ TA ≤ +85°C) | ΔVO/ΔVIN | 10 | 20 | ppm/V | 7 | ||
| Line regulation, F and G grades (−40°C ≤ TA ≤ +125°C) | ΔVO/ΔVIN | 20 | ppm/V | 7 | |||
| Load regulation, F and G grades (25°C) | ΔVO/ΔVLOAD | 6 | 15 | ppm/mA | 6 | ||
| Load regulation, F and G grades (−40°C ≤ TA ≤ +85°C) | ΔVO/ΔVLOAD | 10 | 20 | ppm/mA | 7 | ||
| Load regulation, F and G grades (−40°C ≤ TA ≤ +125°C) | ΔVO/ΔVLOAD | 20 | ppm/mA | 7 | |||
| Dropout voltage (25°C) | VS − VO | 1 | V | VS = 3.5 V, ILOAD = 10 mA | 6 | ||
| Dropout voltage (25°C) | VS − VO | 1.4 | V | VS = 3.9 V, ILOAD = 30 mA | 6 | ||
| Dropout voltage (−40°C ≤ TA ≤ +85°C) | VS − VO | 1 | V | VS = 3.5 V, ILOAD = 10 mA | 7 | ||
| Dropout voltage (−40°C ≤ TA ≤ +85°C) | VS − VO | 1.5 | V | VS = 4.0 V, ILOAD = 25 mA | 7 | ||
| Dropout voltage (−40°C ≤ TA ≤ +125°C) | VS − VO | 1 | V | VS = 3.5 V, ILOAD = 10 mA | 7 | ||
| Dropout voltage (−40°C ≤ TA ≤ +125°C) | VS − VO | 1.5 | V | VS = 4.0 V, ILOAD = 20 mA | 7 | ||
| Long-term stability | ΔVO | 1.2 | mV | 1000 hours @ 125°C | 6 | ||
| Noise voltage | eN | 25 | μV p-p | 0.1 Hz to 10 Hz | 6 | ||
| Logic high input voltage (SLEEP pin) | VH | 2.4 | V | 7 | |||
| Logic high input current (SLEEP pin) | IH | -8 | μA | 7 | |||
| Logic low input voltage (SLEEP pin) | VL | 0.8 | V | 7 | |||
| Logic low input current (SLEEP pin) | IL | -8 | μA | 7 | |||
| Supply current | 45 | μA | No load | 7 | |||
| Supply current, sleep mode | 15 | μA | No load | 7 | |||
| Supply voltage | -0.3 | 18 | V | 16 | |||
| Output to GND | -0.3 | V | Upper limit printed as VS + 0.3 V | 16 | |||
| Operating temperature range (REF19x) | -40 | 125 | °C | 16 | |||
| Storage temperature range (PDIP, SOIC package) | -65 | 150 | °C | 16 | |||
| Junction temperature range (PDIP, SOIC package) | -65 | 150 | °C | 16 | |||
| Lead temperature (soldering) | 300 | °C | Soldering 60 sec | 16 | |||
| Thermal resistance, junction-to-ambient, 8-Lead SOIC (R) | θJA | 158 | °C/W | Device soldered in circuit board | 16 | ||
| Thermal resistance, junction-to-case, 8-Lead SOIC (R) | θJC | 43 | °C/W | 16 |
CAD (KiCad official)
- Symbol:
REF192GSZ-REEL7 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
ref192gsz-reel7-etched.step/ref192gsz-reel7-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ref192gsz-reel7.step/ref192gsz-reel7.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (28 pp, sha256
71d24ecc74f76ebc, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).