component
ASMD1812-110
Public Made by Adomby adom
Shenzhen JDT Fuse Resettable Fuses, 1812. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownASMD1812-110
Shenzhen JDT Fuse · Resettable Fuses · 1812
ASMD1812-110 from Shenzhen JDT Fuse, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JDT Fuse |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum operating voltage (V max), ASMD1812-110 base part | V max | 8 | V dc | Maximum operating voltage at rated current (Imax) | 3 | ||
| Maximum fault current (I max) | I max | 100 | A | At rated voltage (V max) | 3 | ||
| Hold current (I hold) | I hold | 1.1 | A | 25°C still air; device will not trip | 3 | ||
| Trip current (I trip) | I trip | 2.2 | A | 25°C still air; minimum current at which device always trips | 3 | ||
| Minimum resistance prior to tripping (R i min) | R i min | 0.045 | Ω | 25°C, prior to tripping | 3 | ||
| Maximum resistance one hour post reflow (R1max) | R1max | 0.25 | Ω | Measured one hour post reflow | 3 | ||
| Power dissipation in tripped state (P d typ) | P d | 0.8 | W | Tripped state, 25°C still air, at rated voltage | 3 | ||
| Passive aging resistance change | -5 | 5 | % | +85°C, 1000 hrs; ±5% typical | 4 | ||
| Humidity aging resistance change | -5 | 5 | % | +85°C, 85% R.H., 168 hours; ±5% typical | 4 | ||
| Thermal shock resistance change | -33 | 33 | % | +85°C to -40°C, 20 times; ±33% typical | 4 | ||
| Ambient operating temperature | -40 | 85 | °C | Ambient operating conditions | 4 | ||
| Maximum surface temperature in tripped state | 125 | °C | Device in tripped state | 4 | |||
| Hold current at ambient -40°C (Ihold vs ambient) | I hold | 1.6 | A | Ambient -40°C; thermal derating chart for ASMD1812-110 | 5 | ||
| Hold current at ambient -20°C (Ihold vs ambient) | I hold | 1.45 | A | Ambient -20°C; thermal derating chart for ASMD1812-110 | 5 | ||
| Hold current at ambient 0°C (Ihold vs ambient) | I hold | 1.28 | A | Ambient 0°C; thermal derating chart for ASMD1812-110 | 5 | ||
| Hold current at ambient 25°C (Ihold vs ambient) | I hold | 1.1 | A | Ambient 25°C; thermal derating chart for ASMD1812-110 | 5 | ||
| Hold current at ambient 40°C (Ihold vs ambient) | I hold | 0.92 | A | Ambient 40°C; thermal derating chart for ASMD1812-110 | 5 | ||
| Hold current at ambient 50°C (Ihold vs ambient) | I hold | 0.66 | A | Ambient 50°C; thermal derating chart for ASMD1812-110 | 5 | ||
| Hold current at ambient 60°C (Ihold vs ambient) | I hold | 0.83 | A | Ambient 60°C; thermal derating chart for ASMD1812-110 | 5 | ||
| Hold current at ambient 70°C (Ihold vs ambient) | I hold | 0.71 | A | Ambient 70°C; thermal derating chart for ASMD1812-110 | 5 | ||
| Hold current at ambient 85°C (Ihold vs ambient) | I hold | 0.52 | A | Ambient 85°C; thermal derating chart for ASMD1812-110 | 5 | ||
| Storage temperature | 40 | °C | Storage conditions: 40°C max, 70% R.H. max | 8 | |||
| Peak reflow temperature (Tp), Pb-free | Tp | 260 | °C | Pb-free reflow profile peak temperature | 6 |
CAD (KiCad official)
- Symbol:
ASMD1812-110 - Footprint:
Fuse:Fuse_1812_4532Metric - 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
asmd1812-110-etched.step/asmd1812-110-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);asmd1812-110.step/asmd1812-110.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen JDT Fuse datasheet (10 pp, sha256
9a262a458868b11e, retrieved 2026-10-14, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).