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Contents

README

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BZX84B12LT1G

onsemi · Zener Diodes · SOT-23

BZX84B12LT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ANODE passive Anode terminal of the Zener diode; the cathode is identified by the polarity band on the package.
2 NO CONNECTION unconnected Pin 2 is not connected internally and is listed as No Connection in the datasheet pinout.
3 CATHODE passive Cathode terminal of the Zener diode, indicated by the polarity band on the package.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage VZ 11.8 12 12.2 V @ IZT = 5 mA (Note 4), pulse test at TA = 25°C 4
Maximum Zener Impedance ZZT 25 Ω @ IZT = 5 mA (Note 4) 4
Reverse Leakage Current IR 0.1 µA @ VR = 8 V 4
Maximum Temperature Coefficient of VZ (minimum) VZ 6 10 mV/k @ IZT = 5 mA 4
Max. Capacitance C 130 pF @ VR = 0 and f = 1 MHz 4
Forward Voltage VF 0.9 V @ IF = 10 mA 4
Total Power Dissipation on FR-5 Board PD 250 mW @ TA = 25°C (Note 1), FR-5 board 2
Total Power Dissipation on Alumina Substrate PD 300 mW @ TA = 25°C (Note 2), alumina substrate 2
Derating above 25°C, FR-5 Board PD 2 mW/°C Derated above 25°C, FR-5 board (Note 1) 2
Derating above 25°C, Alumina Substrate PD 2.4 mW/°C Derated above 25°C, alumina substrate (Note 2) 2
Thermal Resistance, Junction-to-Ambient, FR-5 Board RθJA 500 °C/W FR-5 board (Note 1) 2
Thermal Resistance, Junction-to-Ambient, Alumina Substrate RθJA 417 °C/W Alumina substrate (Note 2) 2
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 2

CAD (KiCad official)

  • Symbol: BZX84B12LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm tall, datasheet A, nominal). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bzx84b12lt1g-etched.step / bzx84b12lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84b12lt1g.step / bzx84b12lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 062be86009a841c0, retrieved 2026-11-12, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF