component
MRA4007T3G-FS
Public Made by Adomby adom
FUXINSEMI Diodes - General Purpose, SMA(DO-214AC). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMRA4007T3G-FS
FUXINSEMI · Diodes - General Purpose · SMA(DO-214AC)
MRA4007T3G-FS from FUXINSEMI, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | cathode | passive | Cathode terminal, marked by the cathode band on the package; the series is rated for 200 V to 1000 V maximum repetitive peak reverse voltage (VRRM). |
| 2 | anode | passive | Anode terminal; the series is rated for 2.0 A maximum average forward rectified current (IO). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | FUXINSEMI |
| Package | SMA(DO-214AC) |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | 1000 | V | 1 | |||
| Maximum RMS voltage | VRMS | 700 | V | 1 | |||
| Maximum continuous reverse voltage | VR | 1000 | V | 1 | |||
| Maximum average forward rectified current | IO | 2 | A | 1 | |||
| Non-repetitive peak forward surge current | IFSM | 50 | A | 8.3ms single half sine-wave (JEDEC method) | 1 | ||
| Typical junction capacitance | CJ | 30 | pF | Measured at 1MHz, applied reverse voltage 4.0V D.C (Note 1) | 1 | ||
| Maximum reverse leakage current at TJ=25°C | IR | 5 | μA | TJ=25°C, at rated VR | 1 | ||
| Maximum reverse leakage current at TJ=125°C | IR | 50 | μA | TJ=125°C, at rated VR | 1 | ||
| Operating junction temperature range | TJ | -55 | 150 | °C | 1 | ||
| Storage temperature range | TSTG | -65 | 175 | °C | 1 | ||
| Typical thermal resistance junction to ambient | RθJA | 48 | °C/W | Mounted on FR-4 PCB copper, minimum recommended pad layout (Note 2) | 1 | ||
| Typical thermal resistance junction to case | RθJC | 26 | °C/W | Mounted on FR-4 PCB copper, minimum recommended pad layout (Note 2) | 1 |
CAD (KiCad official)
- Symbol:
MRA4007T3G-FS - Footprint:
Diode_SMD:D_SMA - 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files:
mra4007t3g-fs-etched.step/mra4007t3g-fs-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mra4007t3g-fs.step/mra4007t3g-fs.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: FUXINSEMI datasheet (4 pp, sha256
0af97ea408ba5661, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).