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Contents

README

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STIEC45-30AS

STMicroelectronics · TVS · SMC(DO-214AB)

STIEC45-30AS from STMicroelectronics, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMC(DO-214AB)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage VBR 33.3 35 36.8 V at IR = 1 mA 2
Clamping voltage VCL 55 V at IPP = 500 A, 1.2/50 μs - 8/20 μs 2
Peak pulse current (8/20 μs) Ipp 500 A Tj initial = Tamb 2
Storage temperature range Tstg -65 150 °C 2
Operating junction temperature range Tj -55 150 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2
Junction to ambient thermal resistance Rth(j-a) 90 °C/W on printed circuit on recommended pad layout 2
Junction to leads thermal resistance Rth(j-l) 15 °C/W 2
Leakage current at VRM, 25 °C IRM 0.2 μA at VRM = 30 V, 25 °C 2
Leakage current at VRM, 85 °C IRM 1 μA at VRM = 30 V, 85 °C 2
Stand-off voltage VRM 30 V 2
Dynamic resistance RD 0.036 Ω 8/20 μs 2
Voltage temperature coefficient αT 9.9 10-4/°C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper versus copper surface under each lead 4

CAD (KiCad official)

  • Symbol: STIEC45-30AS
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
  • 3D model files: stiec45-30as-etched.step / stiec45-30as-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stiec45-30as.step / stiec45-30as.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (11 pp, sha256 02e060f1d052dbe0, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF