component
BAW56-TP
Public Made by Adomby adom
MCC Micro Commercial Components Switching Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBAW56-TP
MCC Micro Commercial Components · Switching Diodes · SOT-23
BAW56-TP from MCC Micro Commercial Components, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K1 | passive | Cathode of diode 1 (bottom-left pin in the schematic); part rated VR 75V, IF 250mA continuous. |
| 2 | K2 | passive | Cathode of diode 2 (bottom-right pin in the schematic); part rated VR 75V, IF 250mA continuous. |
| 3 | A | passive | Common anode of both diodes (top pin in the schematic); total power dissipation 350mW, peak forward surge 1.0A (t=1s). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MCC Micro Commercial Components |
| Package | SOT-23 |
| Category | Diodes |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Voltage | VR | 75 | V | 1 | |||
| Continuous Current | IF | 250 | mA | 1 | |||
| Power Dissipation | PTOT | 350 | mW | 1 | |||
| Peak Forward Surge Current | IFSM | 1 | A | t=1s, Non-Repetitive | 1 | ||
| Maximum Instantaneous Forward Voltage | VF | 855 | mV | IFM = 10mA; TJ = 25°C; pulse test: pulse width 300 µs, duty cycle 2% | 1 | ||
| Maximum DC Reverse Current at Rated DC Blocking Voltage | IR | 2.5 | µA | VR=75 Volts; TJ = 25°C | 1 | ||
| Maximum DC Reverse Current at Rated DC Blocking Voltage | IR | 50 | µA | VR=75 Volts; TJ = 150°C | 1 | ||
| Operating Temperature | -55 | 150 | °C | 1 | |||
| Storage Temperature | -55 | 150 | °C | 1 | |||
| Maximum Thermal Resistance, Junction to Ambient | 357 | K/W | Junction to ambient | 1 |
CAD (KiCad official)
- Symbol:
BAW56-TP - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
baw56-tp-etched.step/baw56-tp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);baw56-tp.step/baw56-tp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MCC Micro Commercial Components datasheet (3 pp, sha256
711360dbf1fe16a7, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).