component
IR2108STRPBF
Public Made by Adomby adom
Infineon Technologies Gate Drivers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownIR2108STRPBF
Infineon Technologies · Gate Drivers · SOIC-8
IR2108STRPBF from Infineon Technologies, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Low side and logic fixed supply, recommended 10 V to 20 V and absolute maximum -0.3 V to 25 V, referenced to COM. |
| 2 | HIN | input | Logic input for the high side gate driver output (HO), in phase, referenced to COM; logic 1 requires at least 2.9 V and logic 0 at most 0.8 V with VCC = 10 V to 20 V. |
| 3 | LIN | input | Logic input for the low side gate driver output (LO), out of phase, referenced to COM; logic 1 requires at least 2.9 V and logic 0 at most 0.8 V with VCC = 10 V to 20 V. |
| 4 | COM | power_in | Low side return and reference for all voltage ratings, logic inputs and outputs HO and LO. |
| 5 | LO | output | Low side gate driver output, swinging between COM and VCC (recommended VLO 0 V to VCC). |
| 6 | VS | power_in | High side floating supply return; offset must stay between VB - 25 V and VB + 0.3 V, recommended up to 600 V, with dVS/dt limited to 50 V/ns. |
| 7 | HO | output | High side gate driver output, swinging between VS and VB (VHO limited to VS - 0.3 V to VB + 0.3 V). |
| 8 | VB | power_in | High side floating supply, recommended VS + 10 V to VS + 20 V and absolute maximum -0.3 V to 625 V referenced to COM. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | SOIC-8 |
| Category | Motor Driver ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| High side floating absolute voltage | VB | -0.3 | 625 | V | 2 | ||
| Low side and logic fixed supply voltage | VCC | -0.3 | 25 | V | 2 | ||
| Low side output voltage | VLO | -0.3 | V | 2 | |||
| Allowable offset supply voltage transient | dVS/dt | 50 | V/ns | 2 | |||
| Package power dissipation (8 lead SOIC) | PD | 0.625 | W | TA ≤ +25C | 2 | ||
| Thermal resistance, junction to ambient (8 lead SOIC) | RthJA | 200 | C/W | 8 lead SOIC | 2 | ||
| Junction temperature | TJ | 150 | C | 2 | |||
| Storage temperature | TS | -50 | 150 | C | 2 | ||
| Lead temperature (soldering) | TL | 300 | C | 10 seconds | 2 | ||
| High side floating supply offset voltage | VS | 600 | V | Note 1 | 2 | ||
| Low side and logic fixed supply voltage | VCC | 10 | 20 | V | 2 | ||
| Low side output voltage | VLO | 0 | V | 2 | |||
| Ambient temperature | TA | -40 | 125 | C | 2 | ||
| Logic "1" input voltage for HIN & logic "0" for LIN | VIH | 2.9 | V | VCC = 10V to 20V | 3 | ||
| Logic "0" input voltage for HIN & logic "1" for LIN | VIL | 0.8 | V | VCC = 10V to 20V | 3 | ||
| High level output voltage, VBIAS - VO | VOH | 0.8 | 1.4 | V | IO = 20 mA | 3 | |
| Low level output voltage, VO | VOL | 0.3 | 0.6 | V | IO = 20 mA | 3 | |
| Offset supply leakage current | ILK | 50 | µA | VB = VS = 600V | 3 | ||
| Quiescent VBS supply current | IQBS | 20 | 75 | 130 | µA | VIN = 0V or 5V | 3 |
| Quiescent VCC supply current | IQCC | 0.4 | 1 | 1.6 | mA | VIN = 0V or 5V; RDT=0 | 3 |
| Logic "1" input bias current | IIN+ | 5 | 20 | µA | HIN = 5V, LIN = 0V | 3 | |
| Logic "0" input bias current | IIN- | 2 | µA | HIN = 0V, LIN = 5V | 3 | ||
| VCC and VBS supply undervoltage positive going threshold | VCCUV+, VBSUV+ | 8 | 8.9 | 9.8 | V | 3 | |
| VCC and VBS supply undervoltage negative going threshold | VCCUV-, VBSUV- | 7.4 | 8.2 | 9 | V | 3 | |
| Undervoltage hysteresis | VCCUVH, VBSUVH | 0.3 | 0.7 | V | 3 | ||
| Output high short circuit pulsed current | IO+ | 120 | 200 | mA | VO = 0V, PW ≤ 10 s | 3 | |
| Output low short circuit pulsed current | IO- | 250 | 350 | mA | VO = 15V, PW ≤ 10 s | 3 | |
| Turn-on propagation delay | ton | 220 | 300 | nsec | VS = 0V | 3 | |
| Turn-off propagation delay | toff | 200 | 280 | nsec | VS = 0V or 600V | 3 | |
| Delay matching /ton - toff/ | MT | 0 | 30 | nsec | 3 | ||
| Turn-on rise time | tr | 150 | 220 | nsec | VS = 0V | 3 | |
| Turn-off fall time | tf | 50 | 80 | nsec | VS = 0V | 3 | |
| Deadtime: LO turn-off to HO turn-on (DTLO-HO) and HO turn-off to LO turn-on (DTHO-LO) | DT | 400 | 540 | 680 | nsec | RDT= 0 | 3 |
| Deadtime matching = /DTLO-HO - DTHO-LO/ | MDT | 0 | 60 | nsec | RDT=0 | 3 |
CAD (KiCad official)
- Symbol:
IR2108STRPBF - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
ir2108strpbf-etched.step/ir2108strpbf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ir2108strpbf.step/ir2108strpbf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (23 pp, sha256
a8c23cdba6c57983, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).