component
FS12BDF
Public Made by Adomby adom
FUXINSEMI ESD Protection Devices, DFN1006-2. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownFS12BDF
FUXINSEMI · ESD Protection Devices · DFN1006-2
FS12BDF from FUXINSEMI, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | FUXINSEMI |
| Package | DFN1006-2 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage temperature range | Tstg | -55 | 150 | ℃ | 1 | ||
| Operating junction temperature range | Tj | -55 | 125 | ℃ | 1 | ||
| Lead soldering temperature | TL | 260 | ℃ | 10 sec. | 1 | ||
| Peak pulse power dissipation on 8/20 μs waveform | PPP | 120 | W | 8/20 μs waveform | 1 | ||
| ESD per IEC 61000-4-2 (Air) | VESD | -30 | 30 | kV | per IEC 61000-4-2 (Air) | 1 | |
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 | 30 | kV | per IEC 61000-4-2 (Contact) | 1 | |
| Reverse Working Voltage | VR | 12 | V | 2 | |||
| Reverse Breakdown Voltage | VBR | 13.3 | V | IT = 1mA | 2 | ||
| Reverse Leakage Current | IR | 1 | μA | VR = 12V | 2 | ||
| Peak Pulse Current | Ipp | 4 | A | tp = 8/20μs | 2 | ||
| Clamping Voltage | VC | 20 | V | IPP = 1.0A, tp = 8/20μs | 2 | ||
| Clamping Voltage | VC | 30 | V | IPP = 4.0A, tp = 8/20μs | 2 | ||
| Junction Capacitance | CJ | 8 | pF | VR = 0V, f = 1MHz | 2 |
CAD (KiCad official)
- Symbol:
FS12BDF - Footprint:
Diode_SMD:D_SOD-882 - 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files:
fs12bdf-etched.step/fs12bdf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fs12bdf.step/fs12bdf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: FUXINSEMI datasheet (4 pp, sha256
cce27170195fed9f, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).