component
LM4863M
Public Made by Adomby adom
HGSEMI Audio Amplifiers, SOP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM4863M
HGSEMI · Audio Amplifiers · SOP-16
LM4863M from HGSEMI, in a SOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SHUTDOWN | input | Active-high shutdown control; taking it to VDD puts the part in low-power shutdown (0.7µA typ), and it should be tied to GND for normal operation or never left floating. |
| 2 | GND | power_in | Ground. |
| 3 | +OUTA | output | Channel A non-inverting bridge output; the speaker load connects between -OUTA and +OUTA. |
| 4 | VDD | power_in | Positive supply, 2.0V to 5.5V operating range (6.0V absolute maximum). |
| 5 | -OUT A | output | Channel A inverting bridge output; the speaker load connects between -OUTA and +OUTA. |
| 6 | -IN A | input | Channel A inverting input, connected through Ri and Ci with feedback resistor Rf to set closed-loop gain. |
| 7 | GND | power_in | Ground. |
| 8 | +IN A | input | Channel A non-inverting input. |
| 9 | +IN B | input | Channel B non-inverting input. |
| 10 | BYPASS | passive | Half-supply bias node; connect a capacitor CB (1.0µF typical) to ground to filter the VDD/2 reference and improve PSRR. |
| 11 | -IN B | input | Channel B inverting input, connected through Ri and Ci with feedback resistor Rf to set closed-loop gain. |
| 12 | -OUT B | output | Channel B inverting bridge output; the speaker load connects between -OUTB and +OUTB. |
| 13 | VDD | power_in | Positive supply, 2.0V to 5.5V operating range (6.0V absolute maximum). |
| 14 | +OUT B | output | Channel B non-inverting bridge output; the speaker load connects between -OUTB and +OUTB. |
| 15 | GND | power_in | Ground. |
| 16 | HP-IN | input | Headphone sense input; 4V to VDD disables Amp2A and Amp2B (single-ended headphone mode), and below 0.8V selects bridged mode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-16 |
| Category | Amplifiers/Comparators |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (VDD) | VDD | 2 | 5.5 | V | 4 | ||
| Quiescent power supply current (HP-IN=0V) | IDD | 11.5 | 20 | mA | VIN=0V，IO=0A，HP-IN=0V | 4 | |
| Quiescent power supply current (HP-IN=4V) | IDD | 6 | 5.8 | mA | VIN=0V，IO=0A，HP-IN=4V | 4 | |
| Shutdown current | ISD | 2 | 0.7 | µA | VDD与SHUTDOWN脚相连 | 4 | |
| Headphone high-level input voltage | VIH | 4 | V | 4 | |||
| Headphone low-level input voltage | VIL | 0.8 | V | 4 | |||
| Output offset voltage (bridge mode) | VOS | 5 | 50 | mV | VIN=0V | 4 | |
| Output offset voltage (single-ended mode) | VOS | 5 | 50 | mV | VIN=0V | 5 | |
| Output power (single-ended mode) | PO | 75 | 85 | mW | THD+N=0.5%,f=1kHz,RL=32Ω | 5 | |
| Supply voltage | 6 | V | 3 | ||||
| Input voltage | -0.3 | V | 3 | ||||
| Storage temperature | -65 | 150 | ℃ | 3 | |||
| Junction temperature | 150 | ℃ | 3 | ||||
| Operating temperature | -40 | 85 | ℃ | 3 | |||
| Soldering temperature | 260 | ℃ | 焊接温度（10 秒） | 3 | |||
| ESD voltage (human body model) | 2000 | V | 人体模式 | 3 | |||
| ESD voltage (machine model) | 200 | V | 机器模式 | 3 | |||
| Thermal resistance junction-to-case (SOP) | θJC-SOP | 20 | ℃/W | 3 | |||
| Thermal resistance junction-to-ambient (SOP) | θJA-SOP | 80 | ℃/W | 3 |
CAD (KiCad official)
- Symbol:
LM4863M - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOP-16 (KiCad packages3D, STEP)
- 3D model files:
lm4863m-etched.step/lm4863m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm4863m.step/lm4863m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (23 pp, sha256
dff936bbb9e16b28, retrieved 2026-10-19, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).