component
F1D
Public Made by Adomby adom
NH Fast Recovery/High Efficiency Diode, SOD-123FL. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownF1D
NH · Fast Recovery/High Efficiency Diode · SOD-123FL
F1D from NH, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | NH |
| Package | SOD-123FL |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage (F1D) | VRRM | 200 | V | 1 | |||
| Maximum RMS voltage (F1D) | VRMS | 140 | V | 1 | |||
| Maximum DC blocking voltage (F1D) | VDC | 200 | V | 1 | |||
| Maximum average forward rectified current | IF(AV) | 1 | A | 1 | |||
| Peak forward surge current | IFSM | 30 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC method at rated TL) | 1 | ||
| Current squared time per diode | I2t | 3.74 | A2sec | t<8.3ms | 1 | ||
| Maximum instantaneous forward voltage | VF | 1.3 | V | IF=1.0 A (Note 1) | 1 | ||
| Maximum instantaneous reverse current at 25C | IR | 5 | uA | TA=25C, rated DC blocking voltage (see fig.3)(Note 1) | 1 | ||
| Maximum instantaneous reverse current at 125C | IR | 150 | uA | TA=125C, rated DC blocking voltage (see fig.3)(Note 1) | 1 | ||
| Maximum reverse recovery time | TRR | 250 | ns | IF=0.5A, IR=1.0A, IRR=0.25A | 1 | ||
| Typical thermal resistance, junction to ambient | RθJA | 70 | C/W | P.C.B. mounted with 0.1"*0.1" (2.54 x 2.54 mm) copper pad areas (Note 2) | 1 | ||
| Typical thermal resistance, junction to case | RθJC | 20 | C/W | 1 | |||
| Operating junction temperature range | TJ | -55 | 150 | C | 1 | ||
| Storage temperature range | TSTG | -55 | 150 | C | 1 |
CAD (KiCad official)
- Symbol:
F1D - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files:
f1d-etched.step/f1d-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);f1d.step/f1d.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: NH datasheet (5 pp, sha256
812e32894f094342, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).