component
BV-SMBJ24CA
Public Made by Adomby adom
Bencent TVS, SMB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBV-SMBJ24CA
Bencent · TVS · SMB
BV-SMBJ24CA from Bencent, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Bi-directional TVS terminal (no polarity) with 24 V reverse stand-off, 26.7-29.5 V breakdown at 1 mA, and 38.9 V max clamping at 15.5 A (10/1000 µs). |
| 2 | A2 | passive | Bi-directional TVS terminal (no polarity) with 24 V reverse stand-off, 26.7-29.5 V breakdown at 1 mA, and 38.9 V max clamping at 15.5 A (10/1000 µs). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Bencent |
| Package | SMB |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-off Voltage | VR | 24 | V | 2 | |||
| Breakdown Voltage | VBR | 26.7 | 29.5 | V | It = 1 mA | 2 | |
| Test Current | It | 1 | mA | 2 | |||
| Max Clamping Voltage | Vc | 38.9 | V | @IPP, surge waveform 10/1000 µs | 2 | ||
| Max Peak Pulse Current | IPP | 15.5 | A | Surge waveform 10/1000 µs | 2 | ||
| Max Reverse Leakage | IR | 1 | uA | @VR | 2 | ||
| Peak Pulse Power | Ppp | 600 | W | tp=10/1000 µs | 1 | ||
| Operating Junction Temperature Range | TJ | -55 | 150 | ℃ | 3 | ||
| Storage Temperature Range | TS | -55 | 150 | ℃ | 3 | ||
| ESD Immunity, air discharge | -15 | 15 | KV | IEC 61000-4-2 (air) | 1 | ||
| ESD Immunity, contact discharge | -8 | 8 | KV | IEC 61000-4-2 (contact) | 1 |
CAD (KiCad official)
- Symbol:
BV-SMBJ24CA - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
bv-smbj24ca-etched.step/bv-smbj24ca-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bv-smbj24ca.step/bv-smbj24ca.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Bencent datasheet (5 pp, sha256
f4a29e673d303be1, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).