component
FDD8870
Public Made by Adomby adom
UMW MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownFDD8870
UMW · MOSFETs · TO-252
FDD8870 from UMW, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | GATE: gate-to-source voltage is rated at VGS = ±20 V in the absolute maximum ratings. |
| 2 | D | passive | DRAIN: drain-to-source voltage is rated at VDSS = 30 V in the absolute maximum ratings. |
| 3 | S | passive | SOURCE: the datasheet states no pin-specific electrical limit for this terminal. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | UMW |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate to Source Threshold Voltage | VGS(th) | 1.7 | 2.5 | V | VDS=VGS, ID=250µA | 3 | |
| Drain to Source On Resistance | RDS(ON) | 3.2 | 3.9 | mΩ | ID=35A, VGS=10V | 3 | |
| Drain to Source On Resistance | RDS(ON) | 3.6 | 4.4 | mΩ | ID=35A, VGS=4.5V | 3 | |
| Gate to Source Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V | 3 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS=24V, VGS=0V | 3 | ||
| Zero Gate Voltage Drain Current (TJ=150°C) | IDSS | 250 | µA | VDS=24V, VGS=0V, TJ=150°C | 3 | ||
| Drain to Source Breakdown Voltage | BVDSS | 30 | V | ID=250µA, VGS=0V | 3 | ||
| Source to Drain Diode Forward Voltage | VSD | 1.25 | V | ISD=35A | 4 | ||
| Source to Drain Diode Forward Voltage | VSD | 1 | V | ISD=15A | 4 | ||
| Drain to Source Voltage | VDSS | 30 | V | 1 | |||
| Gate to Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Drain Current Continuous | ID | 160 | A | TC=25°C, VGS=10V (Note 1) | 1 | ||
| Drain Current Continuous | ID | 150 | A | TC=25°C, VGS=4.5V (Note 1) | 1 | ||
| Drain Current Continuous (Tamb) | ID | 21 | A | Tamb=25°C, VGS=10V, with RθJA=52°C/W | 1 | ||
| Single Pulse Avalanche Energy | EAS | 690 | mJ | 1 | |||
| Power Dissipation | PD | 160 | W | 1 | |||
| Derate above 25°C | 1.07 | °C/W | Derate above 25°C | 1 | |||
| Storage and Junction Temperature Range | TJ, TSTG | -55 | 175 | °C | 1 | ||
| Thermal Resistance, Junction-to-Case | RθJC | 0.94 | °C/W | TO-252, TO-251 | 2 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 100 | °C/W | TO-252, TO-251 | 2 | ||
| Thermal Resistance, Junction-to-Ambient (1 in² copper pad) | RθJA | 52 | °C/W | TO-252, 1 in² copper pad area | 2 |
CAD (KiCad official)
- Symbol:
FDD8870 - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
fdd8870-etched.step/fdd8870-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fdd8870.step/fdd8870.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: UMW datasheet (13 pp, sha256
2264fa240cc67161, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).